Samsung Electro-Mechanics Co., Ltd.

Lg Energy Solution, Ltd.

Young-Kuk Ko

Sang-Hoon Kim

Sang-Hoon Choy

Yoong Oh

Shin-Wook Jeon

Gyu-Mook Kim

Hea-Sung Kim

Young-Gyu Moon

Yong-Soon Jang

Soon-Sik Choi

A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Printed circuit board

A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.

Printed circuit board and package structure having the same

Growing community of inventors

Suwon-si, South Korea

Young-Kuk Ko