Inktec Co., Inc.

Haeun Chemtec Co., Ltd.

Young-Koo Han

Kwang-Choon Chung

Myung-Bong Yoo

Kwang-Baek Yoon

Kwang Choon Chung

Nam-Boo Cho

Nam Boo Cho

Myung Bong Yoo

Su-Han Kim

Young-Ho Han

Kyong-Min Lee

Hee-Yong Ahn

Woong Ku On

Bong-Ki Jung

Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.

Method for manufacturing a metal printed circuit board

Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

Manufacturing method of double sided printed circuit board

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

Method for manufacturing a double-sided printed circuit board

Growing community of inventors

Bucheon-si, South Korea

Young-Koo Han