Samsung Electro-Mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Korea Research Institute of Chemical Technology

Other

Samsung Led Co., Ltd.

Ecopro Co. Ltd.

Electronics and Telecommunications Research Institute

Cheil Industries Inc.

Luxpia Co., Ltd.

Young Ki Lee

Seog Moon Choi

Sang Hyun Shin

Kwang Soo Kim

Chang Hyun Lim

Young Hoon Kwak

Sung Keun Park

Sun Woo Yun

Bum Seok Suh

Joon Seok Chae

Tae Hyun Kim

Ji Hyun Park

Young Ho Sohn

Jin Suk Son

Jong Man Kim

Chang Seob Hong

Si Joong Yang

Deug-Hee Cho

Tae-Sun Chang

Jin Su Kim

Dong Hwan Kim

Do Jae Yoo

Jong Seob Kim

Kee Ju Um

Hyung Jin Jeon

Hui Chan Yun

Hyo Jin Lee

Cheol Ho Heo

Shan Gao

Hye Sook Shin

Tae Gyu Ryu

Dong-Ku Lee

Chae-Ho Shin

Dong Hak Kwak

Tae Hoon Kim

Tae Yong Lee

Young Bok Yoon

Jong Woon Kim

In Wha Jeong

Hyeong Ho Lee

Seon Goo Lee

Ju Young Park

Jae Hyun Lim

Kil Sung Lee

Chang Jae Heo

Tae Sun Chang

Sang-Eon Park

Seok Jin Kim

Se Jin Jang

Dong Soo Seo

Dooseok Choi

Hong Seok Lee

Jun Woo Myung

Yong Sik Kim

Kyu Hwan Oh

Jae Seok Lee

Tu Won Chang

Hyun Ha Hong

Ki-Seok An

Taek-Mo Chung

Beyong Hwan Ryu

Jung Eun Kang

Sung Youl Choi

Bo Keun Park

Sun Sook Lee

Chang Gyoun Kim

Gun Hwan Kim

Bo Hyun Seo

Ki Ho Seo

Doo Seok Choi

Sun Woo Lee

Jeong Hwan Han

Taek Mo Chung

Min Sang Lee

Ji Woon Choi

Yong Hoon Kwak

Young S Kwon

Je I Back

Mun G Kyong

Hang G Park

Deok H Kim

Sang F Park

Kyu W Choi

Kyu Kwan Oh

Joon Hoi Hur

Kyeol Kwon

Dong Kwon Choi

Ho Seok Yang

Min Young Yoon

Jong Soo Lee

Dong-Koo Lee

Guijia Li

An electronic device is provided. An electronic device includes a radio frequency integrated circuit (RFIC) chip, and an antenna array electrically connected to the RFIC chip, the antenna array including a first face and a second face facing each other in a first direction, and a third face and a fourth face connecting the first and second faces to each other and facing each other in a second direction intersecting the first direction, the antenna array including a plurality of substrates sequentially stacked in a third direction intersecting a plane defined by the first and second directions, first and second antenna modules on the plurality of substrates and sequentially arranged along the first direction, a first metal partition-wall including at least one metal via extending through the plurality of substrates in the third direction, and a second metal partition-wall surrounding the first to fourth faces.

Electronic device

Arrow shaft grinder

A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

Sensing device

The present disclosure relates to an arrowhead having expanding blades, the arrowhead including: a main body having a fitting slot longitudinally formed and having two expanding blade coupling portions on an outer surface thereof; a blade assembly having a rear end fitted in the fitting slot of the main body, having leading edges on both sides of the front thereof, having a guide pin seat hole on a plate surface in which a guide pin is seated, and having a guide hole extending from the guide pin seat hole; and expanding blades each having a hinge shaft coupling hole at one end to be coupled to be hinge-rotatable to the expanding blade coupling portion by a hinge shaft, further having a protrusion at the one end, and having a blade at the front, wherein when the blade assembly is moved rearward, the guide pin pushes the protrusions of the expanding blades so that the expanding blades are unfolded.

Arrowhead having expanding blades

Arrowhead for hunting

An antenna includes a first dielectric substrate and a first feeding element. The first dielectric substrate includes a first insulating layer, and a first radiation plate including a first opening that exposes an upper surface of the first insulating layer. The first feeding element is disposed in the first opening to penetrate the first insulating layer in a direction extending toward a lower surface of the first dielectric substrate. The first feeding element is insulated from the first radiation plate by the first insulating layer. The first feeding element includes a first conductive plate having an upper surface located on a same plane as an upper surface of the first radiation plate.

Dual-band antenna using coupled feeding and electronic device comprising the same

An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.

Antenna apparatus

There are provided a variable resistance memory device and an operating method thereof. In a method for operating a variable resistance memory device, the method includes programming multi-bit data in a multi-bit variable resistance memory cell of the variable resistance memory device, wherein the programming includes: generating sequentially increased program voltage pulses, based on the multi-bit data; and applying the program voltage pulses to the multi-bit variable resistance memory cell, wherein a current-voltage curve of the multi-bit variable resistance memory cell exhibits a self-compliance characteristic, wherein the program voltage pulses are included in a voltage section having the self-compliance characteristic.

Variable resistance memory device and operating method thereof

Arrowhead case

Disclosed herein is a power module package including a heat radiating plate including a step difference portion around an edge portion thereof, a semiconductor chip mounted on a mounting surface of the heat radiating plate, an external connection terminal disposed on an outer periphery of the heat radiating plate, electrically connected to the semiconductor chip, and protruding outwards, a wire for electrical connection between the semiconductor chip and the external connection terminal; and a molding portion for encapsulation of the semiconductor chip and a portion of the heat radiating plate, and in particular, the molding portion does not intrude over an exposed surface of the lower portion of the heat radiating plate through the step difference portion. In addition, disclosed herein is a fabricating method for preventing flush of the molding portion on the exposed surface.

Power module package and method of fabricating the same

Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.

Power semiconductor module

Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Power module package and method for manufacturing the same

Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Heat radiating substrate and method of manufacturing the same

The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

Light emitting device package and method of manufacturing the same

An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Insulation structure for high temperature conditions and manufacturing method thereof

Growing community of inventors

Gyeonggi-do, South Korea

Young Ki Lee