Semes Co., Ltd.

Young Jun Son

Woo Ram Lee

Ki Sang Eum

Byoung Doo Choi

Woo Sin Jung

Sung Chul Jung

Hyun Yoon

Do Yeon Kim

Tae Hoon Lee

Young Un Yun

Jin Ho Choi

Dong Woon Park

Sun Wook Jung

Sung Gyu Lee

Ha Neul Yoo

Proposed is a substrate processing apparatus for cleaning the bottom surface of a substrate. The apparatus includes a processing container configured to form a processing space for a substrate, a substrate support unit provided inside the processing space and configured to support the substrate, a first nozzle unit configured to have a first nozzle member provided on a side of the substrate support unit inside the processing space and supplying a processing fluid toward a center area of a bottom surface of the substrate, and a second nozzle member provided to be fixedly coupled to the substrate support unit and supplying a processing fluid toward an edge area of the bottom surface of the substrate, wherein the first nozzle member is provided to rotate between a center position and an end position of the bottom surface of the substrate.

Substrate processing apparatus and substrate processing method

The present invention provides a pump for supplying a liquid. The pump comprises: a tube member having a hose communicating with a chemical liquid inlet and a chemical liquid outlet, and a cylindrical drum provided to wind the hose, and configured to discharge a chemical liquid through a volume change caused by contraction of the hose wound around the drum; and a driver configured to provide a rotational force such that the hose is wound around the drum.

Torsion pump and apparatus for supplying chemical liquid

A pump for supplying a liquid is provided. The pump including a flexible tube body including a pump chamber; a first flange provided at one end of the tube body; and a second flange provided at the other end of the tube body; and a driving unit for transmitting rotational force to the tube body to twist the tube body, in which the tube body has a bent portion bent at a predetermined angle.

Torsion pump and chemical liquid supply unit

Provided are a pump, an apparatus for supplying a chemical liquid and an apparatus for processing a substrate. The pump includes a tube having elasticity and having a flow path through which a chemical liquid flows in; and a case having an internal space partitioned into at least two chambers through which gas is supplied or discharged, where the at least two chambers cover an outer circumference of the tube. Using the pump, the apparatus for supplying a chemical liquid and the apparatus for processing a substrate, by an operation in which gas is supplied or discharged into each partitioned chamber in the case, by applying or releasing pressure to the outer circumference of each corresponding tube independently without interfering between the internal pressures between the chambers, efficient pumping operation of the pump may be obtained, and precise control of the discharge pressure of the liquid may be implemented.

Pump, apparatus for supplying chemical liquid and apparatus for processing substrate

An apparatus for processing a substrate includes a first bowl and a processing space therein; a first support portion disposed in the processing space and configured to support the substrate in a first support position; a second bowl disposed to move in a first direction in the processing space; a second support portion configured to move upwardly and downwardly with respect to the first support portion to support the substrate between the second support position disposed above the first support position and the third support position, and to move in the first direction; and a cleaning unit including a first cleaning portion disposed below the substrate toward a rear surface of the substrate in the first support position and a second cleaning portion disposed below the substrate and opposing a rear surface of the substrate between the second support position and the third support position.

Apparatus for processing substrate

Provided is a pump for supplying a liquid. The pump includes: a tube including a pump chamber communicating with a chemical liquid inlet and a chemical liquid outlet, and configured to discharge a chemical liquid through a change in volume due to contraction and expansion; and a driving unit contracting or expanding the tube in a longitudinal direction, in which the tube includes: a flexible tube body including a pump chamber which has an increased internal volume when is contracted in a longitudinal direction and has a decreased internal volume when is expanded in the longitudinal direction, and which has a jar shape of which a radius is increased from the chemical liquid inlet to a center of the pump chamber, and the radius is decreased from the pump chamber to the chemical liquid outlet; a first flange provided at one end of the tube body and including the chemical liquid inlet; and a second flange provided at the other end of the tube body and including the chemical liquid outlet.

Pump, chemical liquid supplying unit, and substrate treating apparatus

A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

Growing community of inventors

Cheonan-si, South Korea

Young Jun Son