Lg Innotek Co., Ltd.

Young Ju Han

Deok Ki Hwang

Hee Seok Choi

Seok Beom Choi

Pil Geun Kang

Byung Sook Kim

Ju Won Lee

In Hae Lee

Jin Gyeong Park

Seok Bae

Dong Woo Kang

Won Seok Choi

Jun Sik Shin

Jae Man Park

Hee Jung Lee

Jong Sik Lee

Hyun Gu Im

Jong Heum Yoon

Sungjin Yun

Hyeon Ji Hong

Kweon Jin Lee

Jina Gu

Do Hyuk Yoo

Chan Mi Ju

Sung Sig Kim

Hyun Sung Oh

Young Rok Park

Tae Don Lee

Jae Chung Lim

Jee Hue Joo

Young Il Lee

Seok Hun Bae

An optical path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the upper part of the first substrate; a second substrate disposed on the first substrate; a second electrode disposed on the lower part of the second substrate; and an optical conversion unit disposed between the first electrode and the second electrode. The optical conversion unit includes partition wall portions and receiving portions that are alternately disposed. The receiving portions change optical transmittance in response to the application of voltage, and include a dispersion and optical conversion particles dispersed in the dispersion. The refractive index ratio of the partition wall portions and the receiving portions is 1:0.95 to 1:1.05.

Light route control member and display device comprising same

A light path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed below the second substrate; a light conversion unit disposed between the first electrode and the second electrode; and a power supply unit connected to the first electrode and the second electrode, wherein the light conversion unit includes a partition wall part and a receiving part that are alternately arranged, the receiving part has a light transmittance that changes in response to the application of a voltage, the receiving part includes a dispersion liquid and a plurality of light absorbing particles dispersed in the dispersion liquid, the height of the receiving part is 15 μm to 25 μm, the width of the receiving part is 1.5 μm to 2.5 μm, and the power supply unit includes a power connection part connecting an external power source and the light conversion unit, and a power switch part for turning on/off the transmission of the voltage.

Light route control member

An optical path control member according to an embodiment comprises: a first substrate; a first electrode provided on the upper portion of the first substrate; a second substrate provided on the first substrate; a second electrode provided on the lower portion of the second substrate; and an optical conversion unit provided between the first electrode and the second electrode, wherein the optical conversion unit comprises partition wall parts and accommodation parts which are alternately arranged. The accommodation parts have a light transmission rate that varies according to the application of a voltage, and the accommodation parts comprise a plurality of unit accommodation cells spaced apart from each other, and comprises a dispersion and light-absorbing particles which are dispersed in the dispersion. The light-absorbing particles comprise first particles and second particles, wherein the diameter of the first particles is greater than that of the second particles, and the surfaces of the first particles and the surfaces of the second particles are charged with the same polarity.

Light route control member and display having the same

A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.

Printed circuit board and camera device comprising same

An optical path control member according to an embodiment comprises: a first substrate; a first electrode arranged on the upper surface of the first substrate; a second substrate arranged on top of the first substrate; a second electrode arranged on the lower surface of the second substrate; and an optical conversion unit which is arranged between the first electrode and the second electrode and which defines a first direction and a second direction, wherein the optical conversion unit comprises a partition part and an accommodation part that are alternately arranged in the first direction, the accommodation part includes a plurality of cells arranged to be spaced in the second direction, at least one of the cells includes a first inner side surface and a second inner side surface that are connected to each other, and the first inner side surface and/or the second inner side surface extends in a direction other than the first and second directions.

Light route control member and display device having the same

A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer provided between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode provided on the light-emitting structure; a first connecting electrode provided on the first electrode; a second electrode provided on the light-emitting structure; a second connecting electrode provided on the second electrode; and a support layer provided around the first electrode, the first connecting electrode, the second electrode and the second connecting electrode. The support layer includes a first support layer having a first coefficient of thermal expansion, and a second support layer provided on the first support layer and having a second coefficient of thermal expansion.

Light-emitting device having a plurality of support layers and light-emitting device package including the same

A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer, under the transmissive substrate; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode. A transmissive resin layer is on the transmissive substrate and an insulating layer is between the insulating support member and the reflective electrode layer.

Light emitting device and light emitting apparatus having the same

A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode on a part of the first semiconductor layer, an electrode layer on the second conductive semiconductor layer, an insulating layer on the electrode layer, a second electrode on the electrode layer, a support member on the insulating layer, a first connection electrode connected to the first electrode, and a second connection electrode connected to the second electrode. The insulating layer is disposed on a side surface of the light emitting structure and the part of the first semiconductor layer. The insulating layer includes a first layer and a second layer having a different material from the first layer. The first layer of the insulating layer has a refractive index different from the second layer of the insulating layer.

Light emitting device and light emitting apparatus

Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.

Light emitting device, light emitting device package and light emitting module

According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).

Epoxy resin composition, and printed circuit board using same

A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.

A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member.

Provided are a package including a first conductive layer on a patterned layer, an insulating layer on the patterned layer burying the first conductive layer, a second conductive layer on an outer surface of the insulating layer, and a third conductive layer in the insulating layer electrically connecting the first conductive layer with the second conductive layer. A substrate is formed by printing or coating a paste- or ink-type insulator and conductor on a patterned layer formed on a sapphire wafer. No void is created between the substrate and LED chip, thus enhancing attachment strength. The ceramic-containing insulator is cured at a low temperature, thereby minimizing contraction of and damage to the wafer when the ceramic is fired. Printing methods utilizing viscous paste or ink solves problems with co-planarity of substrate that occur in existing wafer-to-wafer bonding processes and renders several steps of the existing substrate manufacturing process unnecessary.

Growing community of inventors

Seoul, South Korea

Young Ju Han