Samsung Sdi Co., Inc.

Young Joon Lee

Kyuyoung Kim

Myoungyoup Shin

Dong Hwan Lee

Sang Jin Kim

Seungjib Choi

Yong Han Cho

Tae Shin Eom

Hyeongmook Kim

Kyu-Young Kim

Arum Yu

Gyuseok Han

Myoung-Youp Shin

Eunjeong Choi

Sundae Kim

Juho Jung

Myungho Cho

Ieju Kim

Chaehyuk Ko

Yeji Yang

Xinhui Feng

Kwangwon Seo

Eui-Soo Jeong

Chae-Won Pak

Sohyun Kim

Hye-Won Seo

A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a squarylium core including three or more (meth)acrylate groups and a shell surrounding the squarylium core.

Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor

A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, where &#x3c3;D is a standard deviation of tablet diameters and &#x3c3;H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same

A compound, an acrylic polymer formed by a copolymerization reaction of the compound with an ethylenic unsaturated monomer, photosensitive resin composition including the compound being represented by Chemical Formula 1 and a color filter: 

Compound, polymer, photosensitive resin composition, and color filter

A compound, a photosensitive resin composition including the compound, and a color filter manufactured using the photosensitive resin composition, the compound being represented by Chemical Formula 1: 

Compound, photosensitive resin composition including the same, and color filter

A compound represented by Chemical Formula 1, a colorant including the compound, a photosensitive resin composition including the colorant, and a color filter manufactured using the photosensitive resin composition (in Chemical Formula 1, each substituent is the same as defined in the detailed description), 

Compound, colorant including the same, positive photosensitive resin composition including the same and color filter

A compound represented by Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as defined in the detailed description, a photosensitive resin composition including the same, and a color filter manufactured using the photosensitive resin composition are provided. 

Compound, photosensitive resin composition comprising the same and color filter

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Suwon-si, South Korea

Young Joon Lee