Samsung Electronics Co., Ltd.

Young-Joon Kim

Dae-Hyun Kim

Ki-Young Kim

Ji-Hoon Jung

Yun-kwon Park

Young-ho Choi

Sang-min Lim

Moon-young Kim

Rangarajan Jegadeesan

Min Soo Kim

Jae-Hyun Park

Hyun-Soo Kim

Kang-Ho Byun

Sung-Ku Yeo

Ji-Hyun Park

Soo-Hyung Kim

Sang-wook Lee

Dae-Woong Kim

Hun-Cheol Oh

Soon-Hyun Cha

Hyo-Seok Han

Eun-Song Um

Yun-Kwon Park

Sang-Min Lim

Young-Ho Choi

Moon-Young Kim

A wireless power transmitter performs a method for supplying power for wireless charging from the wireless power transmitter to a plurality of wireless power receivers. The wireless charging method includes allocating priorities to one or more electronic devices that connect for wireless charging, and supplying wireless power to the one or more electronic devices based on the priorities. Other embodiments may be implemented.

Method for wireless charging and electronic device thereof

Provided is a wireless power transceiver including a magnetic body, a solenoid coil wound with respect to the magnetic body, and a dual coil spaced downwardly from the solenoid coil and wound with respect to the magnetic body on opposite sides of the solenoid coil, the dual coil being wound in directions opposite to each other.

Wireless power transceiver and display apparatus with the same

An electronic device and method are provided for wirelessly receiving power. The electronic device includes a first core including a first portion extending in a first direction and a second portion extending in a second direction different from the first direction, a first coil wound around the first portion and extending in the first direction, a second coil wound around the second portion and extending in the second direction, and a power processing circuit configured to process power wirelessly received, from a wireless power transmitter, through at least one of the first coil or the second coil.

Wireless power transmitter, wireless power receiving electronic device, and method for operating the same

A wireless power transmitting device for wirelessly transmitting power to an electronic device is provided. The wireless power transmitting device includes a first coil configured to have a first number of windings and to receive power to be transmitted to the electronic device, thereby generating a magnetic field; and a second coil configured to have a second number of windings, which is different from the first number of windings, wherein an induced electromotive force generated, based on the magnetic field generated from the first coil, in the second coil is used for operation of at least one hardware component of the wireless power transmitting device, and wherein a ratio of a voltage applied to the first coil to a voltage applied to the second coil is determined by a ratio of the first number of windings to the second number of windings.

Wireless power transmitting device and electronic device for wirelessly receiving power

An electronic device and method for wirelessly receiving power are provided. The electronic device includes a wired power interface; a power receiving circuit; and a control circuit configured to control the power receiving circuit to wirelessly receive power from a wireless power transmitting device; and provide the received power to an external electronic device through the wired power interface.

Electronic device for wirelessly receiving power and operation method thereof

Provided is a wireless power transceiver including a magnetic body formed in a rod shape with a groove in a middle portion thereof, a solenoid coil wound around the middle portion of the magnetic body in which the groove is formed, and a dual coil disposed substantially perpendicular to the solenoid coil and wound around portions of both sides of the groove of the magnetic body, the dual coil being wound in directions opposite to each other.

A nonvolatile memory device and a method of manufacturing the same are provided. An insulation layer having a high etching rate as compared with a pad oxide layer is formed as a buffer layer between a first STI film formed as a lower part of semiconductor substrate and a second STI film formed as an upper part of the semiconductor substrate, to obtain a pillar CD for an SAP structure. The buffer layer is etched more speedily in comparison with the pad oxide layer in a procedure of etching the pad oxide layer, thus ensuring a sufficient pillar CD without an excessive wet etch-back. Accordingly, a defect occurrence such as a grooving or seam can be prevented in realizing the SAP structure, and a tunnel oxide layer can be formed with uniform thickness.

Nonvolatile memory device

Growing community of inventors

Gyeonggi-do, South Korea

Young-Joon Kim