Samsung Electronics Co., Ltd.

Skhynix Inc.

Young Jo Park

Jin Woo Kim

Young Sik Kim

Young Jin Cho

Seung Yeop Lee

Hee Hyun Nam

Jae Geun Park

Disclosed are a semiconductor device and a stacked semiconductor package. The semiconductor device may include a semiconductor chip and a plurality of chip pads disposed on the semiconductor chip in a second horizontal direction perpendicular to a first horizontal direction. The plurality of chip pads may include: a first chip pad connected to a wire extending in the first horizontal direction, when seen from the top; and a second chip pad connected to a diagonal wire extending in a direction at an angle to the first and second horizontal directions, when seen from the top. The width of the first chip pad in the second horizontal direction may be smaller than the width of the second chip pad in the second horizontal direction.

Semiconductor device using wires and stacked semiconductor package

A method of operating a memory controller is provided. The method of operating a memory controller according to an exemplary embodiment of the present inventive concepts includes sequentially receiving, by the memory controller, first data segments each having a first size from a host, sequentially storing, by the memory controller, the first data segments in the buffer until a sum of sizes of changed data among data stored in a buffer included in the memory controller is a second size, and programming, by the memory controller, the changed data having the second size in a memory space of a non-volatile memory as a second data segment.

Methods of operating a computing system including a host processing data of first size and a storage device processing data of second size and including a memory controller and a non-volatile memory

Growing community of inventors

Yongin-si, South Korea

Young Jo Park