Samsung Electronics Co., Ltd.

Kyungpook National University Industry-Academic Cooperation Foundation

Yonsei University

Korea Electronics Technology Institute

Hanmi Science Co., Ltd.

Samsung Sdi Co., Inc.

Young Il Kim

Duck Hwan Kim

Jea Shik Shin

Chul Kyu Kim

In Sang Song

Jong Keun Song

Hyung Rak Kim

Bae Hyung Kim

Kyung Il Cho

Seung Heun Lee

Jae Chun Lee

Sang Uk Son

Yun Kwon Park

Won Seok Lee

Yong Rae Roh

Jae Hyun Park

Soo Hyun Kim

Dong Wook Kim

Chul Soo Yoon

Jong Soo Woo

Jun Chul Kim

Seong Chan Jun

Kyeong Soo Kim

In Bok Song

Won Young Song

Hyung Man Lee

Young Min Im

Ho Taek Yim

Jeong Eun Yun

Woo Jung Park

Ji Hyun Im

Hwe Kyung Kim

Tae Min Ahn

Myung Jin Kim

Bong Goo Yun

Jun Hyung Lee

Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.

Portable ultrasonic probe having a folder part

A bulk acoustic wave resonator (BAWR) includes a bulk acoustic resonance unit and at least one compensation layer. The bulk acoustic resonance unit includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The first electrode, the second electrode, and the piezoelectric layer each include a material that modifies a resonance frequency based on a temperature, and the at least one compensation layer includes a material that adjusts the resonance frequency modified based on the temperature in a direction opposite to a direction of the modification.

Bulk acoustic wave resonator having a plurality of compensation layers and duplexer using same

A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.

Portable ultrasonic probe

Provided are a matching segment circuit, to which a radio frequency (RF) is applied, and an RF integrated device using the matching segment circuit. The matching segment circuit to which an RF is applied may include an input end connected to a first RF device, a parallel segment having a first capacitor and a first inductor connected in parallel, a second inductor connected to the parallel segment in series, and an output end connected to a second RF device. The first capacitor, the first inductor, and the second inductor may be configured so that an impedance of the first RF device and an impedance of the second RF device may match.

Matching segment circuit to which radio frequency is applied and radio frequency integrated devices using the matching segment circuit

A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig

Disclosed is a method for preparing a fluorescent substance, which is represented by the formula MEuSiON(M=SrBaCa, 0 x 0.5, 0 y 0.2, 0&#x3c;z 0.3, 2 a 2.5, 1.5 b 2, and 2 c 2.5), and the present invention provides the method for preparing a nitride-based fluorescent substance comprising the following steps: a preliminary firing step further comprising a first firing step of creating a first firing product by mixing and firing a first precursor group including an M precursor and a first silicon precursor, and a second firing step of creating a second firing product by mixing and firing a second precursor group including an Eu precursor and a second silicon precursor; and a secondary firing step of mixing and firing the first firing product and the second firing product.

Fluorescent substance and method for preparing same

An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

Ultrasonic probe

A Radio Frequency (RF) duplexer including Bulk Acoustic Wave Resonators (BAWRs) and an RF filter including BAWRs are provided. The RF duplexer may convert the received signal into a balance signal and output the balance signal via a dual-output port. The RF duplexer may also include a BAWR receiving filter unit including an input end to receive the balance signal from the dual-output port, and an output end used for dual output. The RF duplexer may also include a BAWR transmitting filter unit to transmit a transmitted signal to the antenna via a single-output port.

Radio frequency filter and radio frequency duplexer including bulk acoustic wave resonators in a ladder and a bridge

Provided are low pass filters using a bulk acoustic wave resonator (BAWR). A low pass filter may include an input terminal configured to be connected with a first radio frequency (RF) device, an output terminal configured to be connected with a second RF device, a parallel segment including a first BAWR, a third BAWR, and a fifth BAWR that may be connected in parallel with each other to a reference potential, a first series segment having a second BAWR and a first inductor, and a second series segment having a fourth BAWR and a second inductor, and connected in series with the first series segment.

Low pass filter using bulk acoustic wave resonator (BAWR)

Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.

RF layered module using three dimensional vertical wiring and disposing method thereof

The present invention relates to a solid pharmaceutical composition for preventing or treating cardiovascular disorders comprising amlodipine and losartan as active ingredients, and a disintegrant which is a mixture of at least two components selected from the group consisting of sodium starch glycolate, crosscarmellose sodium, and crosspovidone, which exhibits a high and stable level of amlodipine and losartan dissolution rates.

Solid pharmaceutical composition comprising amlodipine and losartan

A Bulk Acoustic Wave Resonator (BAWR), a method of manufacturing of the BAWR, and duplexer including the BAWR are provided. The BAWR may include a first substrate including a via hole formed in a predetermined area of a bottom surface of the first substrate. A first air cavity may be formed above the first substrate, and a first lamination resonating portion may be laminated above the first air cavity in sequence of a lower electrode, a piezoelectric layer, and an upper electrode. A second air cavity may be formed above the first substrate, and a second lamination resonating portion may be laminated above the second air cavity in sequence of the lower electrode, the piezoelectric layer, and the upper electrode. The first lamination resonating portion and the second lamination resonating portion may be connected via either the lower electrode or the upper electrode. A first electrode portion may include a third air cavity formed on a bottom surface of either the lower electrode or the upper electrode connecting between the first lamination resonating portion and the second lamination resonating portion.

Bulk acoustic wave resonator structure, a manufacturing method thereof, and a duplexer using the same

A resonator and a method of manufacturing a resonator are provided. The resonator includes a sacrificial layer formed on a substrate, and a resonant structure formed on the sacrificial layer, the resonant structure comprising a carbon nano-substance layer and a silicon carbide layer.

Resonator using carbon nano substance and method of manufacturing resonator

The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.

Method of packaging optical parts for optical communication

Growing community of inventors

Suwon-si, South Korea

Young Il Kim