Samsung Electronics Co., Ltd.

Lg Semicon Co., Ltd.

Hyundai Electronics Industries Co. Ltd.

Goldstar Electron Co., Ltd.

Young-Hyun Jun

Seong-Jin Jang

Tae-Hoon Kim

Ho-Young Song

Joung-Yeal Kim

Bai-Sun Kong

Chul-Soo Kim

Jae-Goo Lee

Kwang-il Park

Chul-woo Park

Hong-Sun Hwang

Joo-sun Choi

Sang-Bo Lee

Hyong-Ryol Hwang

Sung Ho Wang

Chang-Man Kang

Seung-Jun Bae

Jong-Pil Son

Hak-soo Yu

Uk-Song Kang

Chul-soo Kim

Sang-Joon Hwang

Min-Sang Park

Su-Jin Park

Chan-kyung Kim

Jong-hyoung Lim

Jin-seok Kwak

Seong J Jang

Hee-Chang Cho

Si-Hong Kim

Seung-Yong Shin

Sang-hyup Kwak

Jong-Eon Lee

Tae-Hyoung Kim

Jin-Seok Kwak

Joo-Sun Choi

Kwang-II Park

Ho-Geun Shin

Seong-jin Jang

Chang-Man Khang

Jae-goo Lee

Kwnag-Il Park

Sang-Woong Shin

Jang-won Moon

Sam-Soo Kim

Jae Sik Lee

Beom-seop Lee

Provided is a storage device capable of increasing its life cycle and operating method thereof. The storage device includes a nonvolatile memory device that stores data and a controller that controls the nonvolatile memory device. The controller receive can modify a write time-out value of the nonvolatile memory device in accordance with predetermined conditions, such as request from a host or exceeding of a predefined life cycle.

Storage device capable of increasing its life cycle and operating method thereof

A semiconductor package is disclosed. The semiconductor package includes a package interface, a stack of semiconductor chips, a plurality of stacks of through substrate vias, and an interface circuit. The package interface includes at least a first pair of terminals. Each stack of through substrate vias includes plural through substrate vias of respective ones of the semiconductor chips, each through substrate via electrically connected to a through substrate via of an immediately adjacent semiconductor chip. The interface circuit includes an input connected to the first pair of terminals to receive a differential signal providing first information, and includes an output to provide an output signal including the first information in a single-ended signal format to at least one of the plurality of stacks of through substrate vias.

Semiconductor memory device

A memory device comprising: at least one bank of memory cells that receives a first clock for clocking commands and a second clock for clocking data, wherein the second clock is activated based on a first command and deactivated based on a second command. The memory device further including a clock activation circuit configured to generate an enable signal based on the first command and a disable signal based on the second command, and a clock generator configured to generate the second clock based on a reference clock upon receipt of the enable signal.

Memory controller with reduced power consumption, memory device, and memory system

A semiconductor memory device including a bit line connected to a memory cell and a sense amplifier configured to drive a voltage level of a global bit line in response to a voltage level of the bit line. The sense amplifier provides data that is complementary to data stored in the memory cell to the global bit line and provides the complementary data of the global bit line to the memory cell during an active operation of the memory cell.

Semiconductor memory device having a hierarchical bit line scheme

A memory module can include a plurality of dynamic memory devices that each can include a dynamic memory cell array with respective regions therein, where the plurality of dynamic memory devices can be configured to operate the respective regions responsive to a command. A DRAM management unit can be on the module and coupled to the plurality of dynamic memory devices, and can include a memory device operational parameter storage circuit that is configured to store memory device operational parameters for the respective regions to affect operation of the respective regions responsive to the command.

Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same

A semiconductor memory device for reducing ripple noise of a back-bias voltage, and a method of driving the semiconductor memory device include a word line driving circuit and a delay logic circuit. The word line driving circuit enables a sub-word line connected to a selected memory cell to a first voltage, and disables the sub-word line of a non-selected memory cell to a second voltage and a third voltage, in response to a sub-word line enable signal, a first word line driving signal, and a second word line driving signal. The delay logic circuit controls the semiconductor memory device so that an amount of charge of the sub-word line that is introduced to the third voltage is greater than an amount of charge of the sub-word line that is introduced to the second voltage by changing a transition point of time of the sub-word line enable signal with respect to a transition point of time of the first word line driving signal, during the disabling of the sub-word line.

Semiconductor memory device for reducing ripple noise of back-bias voltage and method of driving semiconductor memory device

A CMOS charge pump with improved latch-up immunity is provided. The CMOS charge pump includes a blocking transistor that disconnects first and second boost nodes from a bulk node in response to a blocking control signal, such that a bulk voltage can be maintained at a predetermined level or higher. The CMOS charge pump in a power-up period first precharges the bulk voltage before the main pump performs a boosting operation and prevents a latch-up phenomenon.

CMOS charge pump with improved latch-up immunity

An input/output (IO) interface includes a data encoder which encodes each of a plurality of pieces of parallel data having different timings and generates a plurality of pieces of encoded data, and an alternating current (AC) coupling transmission unit which transmits the plurality of encoded data in an AC coupling method. The data encoder compares first parallel data with second parallel data from among the plurality of pieces of parallel data on a bit-by-bit basis and obtains the number of bits whose logic states have transited between the first parallel data and the second parallel data. When the number of bits whose logic states have transited is greater than or equal to a reference number of bits, the data encoder inverts bit values of the second parallel data to generate the encoded data. When the number of bits whose logic states have transited is less than the reference number of bits, the data encoder maintains the bit values of the second parallel data to generate the encoded data.

Input/output (IO) interface and method of transmitting IO data

Provided is a semiconductor device for performing charge pumping. The semiconductor device may include a first pumping unit, a second pumping unit, and a controller. The first pumping unit may be configured to output a boosted voltage via an output node by using a first input signal and the initial voltage, where the boosted voltage is greater than an initial voltage. The second pumping unit may be configured to output the boosted voltage via the output node by using a second input signal and the initial voltage. The controller may be configured to control the first and second pumping units. Each of the first and second pumping units may include an initialization unit, a boosting unit, and a transmission unit. The initialization unit may be configured to control a voltage of a boosting node to be equal to the initial voltage during an initialization operation. The boosting unit may be configured to boost the voltage of the boosting node based on the first and second input signals. Also, the transmission unit may be configured to control output of the boosted voltage.

Semiconductor device for charge pumping

A semiconductor memory device includes a plurality of memory cell array blocks, a bit line sense amplifier, a local sense amplifier that can be controlled to be turned on or off, a data sense amplifier, and a controller. The controller activates a local sense control signal for a predetermined duration in response to first and second signals. The first signal is a bit line sense enable signal that activates the bit line sense amplifier, and the local sense amplifier is activated for a predetermined duration after the bit line sense enable signal is activated. The second signal is activated or deactivated in phase with a column selection line signal that connects a pair of bit lines and a pair of local input/output lines. Accordingly, it is possible to turn on or off the local sense amplifier according to operating conditions, thereby increasing a tRCD parameter and reducing the consumption of current. The operating speed of the semiconductor memory device can be improved by combining the local sense amplifier with a current type data sense amplifier that does not require precharging and equalization during a read operation.

Semiconductor memory device having local sense amplifier with on/off control

A latency signal generating method and a corresponding semiconductor memory device, among other things, are disclosed. Such a method includes: receiving a clock signal for the semiconductor memory device; receiving a mode characterization signal; providing the DQS; and adapting the duration of a preamble state of the DQS according to the mode characterization signal to promote conformance of a strobe state of the DQS with the clock signal.

Semiconductor memory device and latency signal generating method thereof

A charge pump circuit includes initialization units, each of which initializes a boost node to an initialization voltage. Boosting units each boost the boost node to a higher voltage than the initialization voltage in response to an input voltage. First and second pump circuits each include a transfer unit for transferring a voltage of the boost node to an output node and sharing the output node. The transfer unit of the first pump circuit includes two transfer transistors that are switched in response to a voltage of a control node of the first pump circuit and the voltage of the boost node of the second pump circuit. The transfer unit of the second pump circuit includes two transfer transistors that are switched in response to a voltage of a control node of the second pump circuit and the voltage of the boost node of the first pump circuit.

Charge pump circuit

Provided is a semiconductor memory device and method that can control internal supply voltages independently. The semiconductor memory device includes a memory cell array, a reference voltage generating unit, an internal reference voltage generating unit, and an internal supply voltage generating unit. The reference voltage generating unit outputs a reference voltage in response to an external voltage. The internal reference voltage generating unit converts the reference voltage into a plurality of internal reference voltages, and outputs the plurality of internal reference voltages. The internal supply voltage generating unit converts the plurality of internal reference voltages into a plurality of internal supply voltages, and outputs the plurality of internal supply voltages. A first internal reference voltage is used to generate a first internal supply voltage and a second internal reference voltage is used to generate a second internal supply voltage.

Semiconductor memory device for independently controlling internal supply voltages and method of using the same

Provided are a temperature sensor using a ring oscillator and temperature detection method using the same. One embodiment of the temperature sensor includes a first pulse generator, a second pulse generator, and a counter. The first pulse generator includes a first ring oscillator and generates a first clock signal having a variable period according to a change in temperature. The second pulse generator includes a second ring oscillator and generates a second clock signal having a fixed period. The counter counts a pulse width of the first clock signal as a function of a pulse width of the second clock signal and generates a temperature code.

Temperature sensor using ring oscillator and temperature detection method using the same

A voltage generation circuit and semiconductor memory device including the same are provided. The voltage generation circuit includes: a voltage level detector, which detects a level of a first high voltage to generate a first high voltage level detection signal and detects a level of a second high voltage to generate a second high voltage level detection signal; a control signal generator, which generates at least four pumping control signals in sequence when the first high voltage level detection signal is active, generates a control signal when the first high voltage level detection signal is inactive, and generates a first one of the at least four pumping control signals in response to a level of a power supply voltage; and a voltage generator, which pumps a boost node in response to the at least four pumping control signals to generate the first high voltage and transmits charge from the boost node to a second high voltage generation terminal in response to the control signal to generate the second high voltage.

Voltage generation circuit and semiconductor memory device including the same

Growing community of inventors

Seoul, South Korea

Young-Hyun Jun