Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Young Hoon Song

Min Cheol Park

Young Ghyu Ahn

Byoung Hwa Lee

Mi Hee Lee

Hyung Duk Yun

Hae Suk Chung

Dong Hwi Shin

Yun Jung Park

Byung Sung Kang

Jin Sung Chun

Tae Hyeong Kim

A Ra Cho

Dong Kyu Lee

Byeongguk Choi

Byung Yong Wang

Yuseop Lee

Seonyoung Yoo

Young Mook Oh

Sug Hyun Sung

Seon Young Yoo

Hyuk Jin Hong

Kyung Seok Min

Dong Seuk Kim

Geon Yong Lee

Yu Seop Lee

Mi Gyeong Gwon

Dong Hoon Keum

Seong Jin Nam

Seong Gu Kang

Hong Gi Kim

Donghwi Shin

A multilayer ceramic capacitor includes a body including a capacitance region in which a plurality of first internal electrodes and a plurality of second internal electrodes are alternately stacked in a first direction with a dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and spaced apart from each other to be connected to the plurality of first internal electrodes and the plurality of second internal electrodes, respectively, wherein the capacitance region includes one or more groups of first openings. The first openings in each group overlap in the first direction and are continuously open in two or more internal electrodes of the plurality of first and second internal electrodes, and a number of internal electrodes included in each group is less than a total number of the plurality of first internal electrodes and the plurality of second internal electrodes.

Multilayer ceramic capacitor

A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO) and a shell portion including the additive and formed on a surface of the core portion.

Method of producing core-shell particles and multilayer ceramic electronic component including core-shell particles

A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, and a capacitance forming portion disposed in such a manner that first and second internal electrodes are stacked with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the ceramic body, respectively, the first and second external electrodes including first and second base electrodes connected to the first and second internal electrodes, respectively, and first and second conductive layers disposed to cover the first and second base electrodes, respectively. The first and second conductive layers have a thickness in a range of 0.1 &#x3bc;m to 10 &#x3bc;m.

Multilayer ceramic electronic component

A multilayer capacitor includes a capacitor body including first to sixth surfaces and including a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively, wherein the capacitor body includes an active region in which the first and second internal electrodes overlap in a first direction, and at least a portion of a margin portion excluding the active region in the capacitor body has a ratio of Ba to Ti less than 1 (Ba/Ti&#x3c;1) and has a twin boundary structure.

Multilayer capacitor comprising capacitor body including active portion and margin portion

A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

Multilayer ceramic electronic component and manufacturing method thereof

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, and including first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, the first and second external electrodes include first and second base electrodes including a first conductive metal and reactive glass, in contact with the ceramic body, and first and second conductive layers including and a second conductive metal, disposed on the first and second base electrodes, and a nanostructure may be disposed on surfaces of the first and second conductive layers.

Dielectric patterns may be additionally disposed in margin portions, and thicknesses of the dielectric patterns may be controlled to improve the reliability of a capacitor component.

Capacitor component

Semiconductor devices are provided. The semiconductor device includes a first fin and a second fin on a substrate and a field insulation layer between the first fin and the second fin. The field insulation layer include a first insulation layer and a second insulation layer on the first insulation layer and connected to the first insulation layer. The second insulation layer is wider than the first insulation layer. A ratio of a top width to a bottom width of each of the first fin and the second fin exceeds 0.5.

Semiconductor device having field insulation layer between two fins

There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 &#x3bc;m or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 &#x3bc;m or less.

Chip type laminated capacitor

There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 &#x25a1;m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths.

Growing community of inventors

Suwon-si, South Korea

Young Hoon Song