International Business Machines Corporation

Other

Young Hoon Kwark

Brian Paul Gaucher

Christian Schuster

Bahman Hekmatshoartabari

Ali Afzali-Ardakani

Tze-Chiang Chen

Kailash Gopalakrishnan

Stanislav Polonsky

Ephraim Bemis Flint

Christian Wilhelmus Baks

Richard Allen John

Joshua T Smith

Jeremy Daniel Schaub

Jingwei Bai

Michael Frank Cina

Modest M Oprysko

Saila Ponnapalli

William Edward Pence, Iv

Yann Andre Nicolas Astier

John Andrew Guckenberger

Paul Andrew Moskowitz

Duixian Liu

Stefan Harrer

Mark B Ritter

Troy James Beukema

Dan Moy

Han Chen

Jeffrey John Welser

Dennis L Rogers

John Douglas Martin, Ii

Eprhaim Bemis Flint

Nobutoyo Nakano

Hiroshi Yoshinaga

Hidenao Hamada

Tsutomu Iwasaki

An apparatus for an electro-fluidic flow probe includes a body portion including an electro-fluidic bias tee for receiving (i) a fluid electrolyte and (ii) an electrical connection for providing an electrical potential to the fluid electrolyte; a first inlet including a tube extending from the first inlet to an outlet through the electro-fluidic bias tee; and a second inlet including the electrical connection having a wire that extends from the second inlet to the outlet through the electro-fluidic bias tee to transfer the electrical potential to a device under test.

Electro-fluidic flow probe

An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.

Integrated circuit chip packaging including a heat sink topped cavity

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.

Integrated circuit chip packaging

A micro-droplet fluidic cell includes a membrane structure having a nanopore, a hydrophobic material disposed onto a portion of the membrane structure, and an analyte solution traversing the membrane structure and forming a micro-droplet on a first surface of the membrane structure. Also disclosed are methods for fast ionic current detection using the micro-droplet fluidic cell.

Micro-droplet fluidic cell for fast ionic current detection using nanopores

An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.

An apparatus with a programmable response includes a semiconductor device with a junction formed thereon, the junction having a built-in potential, a quantum well element proximate to the junction that provides an energy well within a depletion region of the junction. The energy well comprises one or more donor energy states that support electron trapping, and/or one or more acceptor energy states that support hole trapping; thereby modulating the built-in potential of the junction. The semiconductor device may be a diode, a bipolar diode, a transistor, or the like. A corresponding method is also disclosed herein.

Semi-conductor device with programmable response

Semiconductor device with programmable response

An apparatus with a programmable response includes a semi-conductor device with a junction formed thereon, the junction having a built-in potential, a quantum well element proximate to the junction that provides an energy well within a depletion region of the junction. The energy well comprises one or more donor energy states that support electron trapping, and/or one or more acceptor energy states that support hole trapping; thereby modulating the built-in potential of the junction. The semi-conductor device may be a diode, a bipolar diode, a transistor, or the like. A corresponding method is also disclosed herein.

A method is provided to form an electromechanical relay. A magnetic layer is etched to form a substrate-metal structure having a pattern of conductive contacts. The substrate-metal structure is electroplated. The electroplated structure is attached to a printed circuit board (PCB). A portion of the electroplated structure is removed to electrically decouple the conductive contacts. The PCB includes a common contact terminal aligned to one end of each conductive contact. The PCB includes magnetic actuators each having a magnetic core with a first core part disposed within a via extending through layers of the PCB, and an electrical coil disposed around the first core part within layers of the PCB. Each conductive contact is aligned to an associated magnetic actuator to enable electrical contact between the common contact terminal and the conductive contact upon activation of the associated magnetic actuator.

Method of forming an integrated electromechanical relay

Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.

Integrated electromechanical relays

A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.

High performance resonant element

Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. To test the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer.

Testing of transimpedance amplifiers

A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Growing community of inventors

Chappaqua, NY, United States of America

Young Hoon Kwark