Samsung Electronics Co., Ltd.

Young-Gu Shin

Jeong-Ho Bang

Hyuk Jae Kwon

Hyoung-Young Lee

Hyun-Seop Shim

Ki-Bong Ju

Kyoung-Il Heo

Yong-Woon Kim

Woo-Ik Park

A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.

Multichip package test

Provided is a system and method of testing a plurality of devices under test (DUTs) in parallel. The method includes preparing at least two DUTs having input/output signal pins connected in common to one input/output signal channel and having chip selection signal pins connected to a chip selection signal channel, which provides a chip selection signal to specify one output data among output data to be outputted through the commonly connected input/output channel. The method includes reading the outputted data specified by the chip selection signal through the commonly connected input/output signal channel from one of the devices under test selected by the chip selection signal.

System used to test plurality of DUTs in parallel and method thereof

Growing community of inventors

Choongchungnam-do, South Korea

Young-Gu Shin