Growing community of inventors

Suwon-si, South Korea

Young Gi Lee

Average Co-Inventor Count = 7.78

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 0

Young Gi LeeSundae Kim (3 patents)Young Gi LeeMyungho Cho (3 patents)Young Gi LeeIeju Kim (3 patents)Young Gi LeeYeji Yang (3 patents)Young Gi LeeChaehyuk Ko (2 patents)Young Gi LeeBaek Soung Park (2 patents)Young Gi LeeJungsun Lee (2 patents)Young Gi LeeXinhui Feng (2 patents)Young Gi LeeJong Won Lee (1 patent)Young Gi LeeArum Yu (1 patent)Young Gi LeeEuisoo Jeong (1 patent)Young Gi LeeHyun Woo Lee (1 patent)Young Gi LeeJi Ho Lee (1 patent)Young Gi LeeYeon Soo Lee (1 patent)Young Gi LeeSoo Yeon Sim (1 patent)Young Gi LeeChang Suk Lee (1 patent)Young Gi LeeYoung Gi Lee (4 patents)Sundae KimSundae Kim (5 patents)Myungho ChoMyungho Cho (4 patents)Ieju KimIeju Kim (4 patents)Yeji YangYeji Yang (4 patents)Chaehyuk KoChaehyuk Ko (4 patents)Baek Soung ParkBaek Soung Park (3 patents)Jungsun LeeJungsun Lee (3 patents)Xinhui FengXinhui Feng (3 patents)Jong Won LeeJong Won Lee (76 patents)Arum YuArum Yu (12 patents)Euisoo JeongEuisoo Jeong (10 patents)Hyun Woo LeeHyun Woo Lee (7 patents)Ji Ho LeeJi Ho Lee (2 patents)Yeon Soo LeeYeon Soo Lee (1 patent)Soo Yeon SimSoo Yeon Sim (1 patent)Chang Suk LeeChang Suk Lee (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Samsung Sdi Co., Inc. (4 from 7,657 patents)


4 patents:

1. 12509588 - Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter, and CMOS image sensor

2. 12504684 - Core-shell dye, photosensitive resin composition including the same, and color filter

3. 12077681 - CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same

4. 12055851 - Core-shell compound, photosensitive resin composition including the same, photosensitive resin layer, color filter and CMOS image sensor

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1/9/2026
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