Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Young Ghyu Ahn

Sang Soo Park

Min Cheol Park

Byoung Hwa Lee

Heung Kil Park

Dong Hwan Lee

Chan Young Yoon

Kyo Kwang Lee

Soo Hwan Son

Won Chul Sim

Hwi Dae Kim

Jin A Kim

Dong Jin Lee

Dong Seok Park

Soon Ju Lee

Se Hun Park

Jae Yeol Choi

Doo Young Kim

Gu Won Ji

Sung Kwon Wi

Young Seuck Yoo

Hyun Tae Kim

Jong Hwan Park

Tae Hyeok Kim

Kang Heon Hur

Yong Suk Kim

Doo Il Kim

Young Key Kim

Hwi Geun Im

Man Su Byun

Young Hoon Song

Mi Hee Lee

Kyoung Jin Jun

Ju Eun Nam

Se Hwa Jeong

Sang Moon Lee

Taek Jung Lee

Ho Yoon Kim

Ho Jun Lee

Jung Min Park

Seok Kyoon Woo

Jeong Bok Kwak

Hyun Cheol Oh

Jong Ho Lee

Byeong Cheol Moon

Sung Jin Park

Myung Jun Park

Seung Yong Lee

Seok Hyun Yoon

Hyun Hee Gu

Chang Sik Kim

Young Do Kweon

Chang Hoon Kim

Jeong Min Cho

Ho Young Kim

Sang Huk Kim

Jae Hyuk Choi

Byung Jun Jeon

Hong Kyu Shin

Hang Kyu Cho

Beom Seock Oh

So Yeon Song

Ji Young Park

Yu Jin Choi

Woo Jin Choi

Jea Yeol Choi

Jong Duck Kim

Yu Ra Shin

Geon Se Chang

Dae Heon Jeong

Chang Su Kim

Bong Sup Lim

Jin O Yoo

Jea Hoon Lee

Soo Han Park

Jin Ho Ku

Ill Kyoo Park

Jin Yung Ryu

Yeong Lim Kwon

Joon Yeob Cho

Oh Choon Kwon

Su Jung Kim

Won Chui Sim

Jeong Pil Jhun

Kyoung Nam Hwang

Woo Jin In

Young Sun Park

Tae Youn Heor

A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The internal electrode is connected to the external electrode through a lead-out portion. With respect to a cross-section of the internal electrode in the second and third directions, when an average length of the lead-out portion in contact with the external electrode is defined as 'A' and an average length of the external electrode, connected to the lead-out portion, in contact with the body is defined as “B,” “A/B” is 0.75 or less.

Multilayer electronic component and board having multilayer electronic component mounted thereon

A ceramic electronic component including: a body including a dielectric layer and internal electrodes; and external electrode disposed on the body and including boron, wherein a ratio of isotopeB in boron is 20% or more. In some example embodiments, boron is included in the form of boric oxide (BO).

Ceramic electronic component having external electrode which includes boron with high ratio of isotope 10B

A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost surface of the electrode layer, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.

Multilayer electronic component

A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween in a first direction; and external electrodes connected to the internal electrodes. The body has first and second surfaces opposing each other in the first direction and one or more side surfaces positioned between the first and second surfaces. The body has a protruding portion protruding in the first direction and outer peripheral portions around the protruding portion on the first surface of the body. The external electrodes cover the outer peripheral portions, the side surfaces, and the second surface of the body. In the second surface of the body, portions that are covered by the external electrodes and a portion that is not covered by the external electrodes are substantially coplanar with each other.

A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes, first external electrodes respectively be connected to the first internal electrode and second external electrodes respectively connected to the second internal electrode. The first internal electrode includes a first main portion and a first lead-out portion. The first lead-out portion includes a first inclined portion and a first connection portion. The first inclined portion is connected to the first main portion and has a side surface, at least a portion of which is inclined with respect to a side surface of the first main portion connected thereto. The first connection portion is connected to the first inclined portion and the first external electrode, and has a side surface, at least a portion of which is inclined with respect to the side surface of the first inclined portion connected thereto.

Multilayer capacitor

A coil component includes a support substrate, first and second coil units disposed on the support substrate and spaced apart from each other, and a body having a first core and a second core spaced apart from the first core. The first and second coil units include first and second winding portions having at least one turn around the first and second cores, respectively, and first and second extension portions respectively extending from the first and second winding portions, each of the first and second extension portions surrounding the first and second cores. The first and second winding portions are spaced apart from each other in a direction in which the first extension portion extends from the first winding portion.

Coil component

A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween; a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode; a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body.

A coil component includes a body having end surfaces opposing each other and side surfaces connecting the end surfaces and opposing each other, a support substrate disposed within the body and having a first surface and a second surface opposing each other, first and second coil units disposed on the first surface and the second surface of the support substrate, respectively, and each including a plurality of turns, and lead portions connected to the first and second coil units and exposed to a first end surface and a second end surface of the body, respectively. A shortest distance from an outermost turn of the first coil unit to the second end surface of the body is greater than a shortest distance from the outermost turn of the first coil unit to a first side surface of the body.

A multilayer capacitor includes: a body including internal electrodes stacked in a first direction; and first and second external electrodes disposed on the body. A portion of the first external electrode overlaps the body in the first direction and does not overlap a remainder of the first external electrode in the first direction. A portion of the second external electrode overlaps the body in the first direction and does not overlap a remainder of the second external electrode in the first direction. At least one of the external electrodes includes: a second electrode layer covering a first electrode layer, which covers one portion of an edge of the body. A width Wof a portion of the first electrode layer, closest to the one portion of the edge, is narrower than a width Wof an end of the second electrode layer, farthest from the first electrode layer.

A multilayer capacitor includes a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be connected to the at least one first internal electrode and the at least one second internal electrode, respectively, wherein the body further includes a buffer layer disposed in the capacitance region and having a Young's modulus of greater than 0 time and (50/135) times or less of a Young's modulus of the at least one dielectric layer.

A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other interposing at least one dielectric layer therebetween in a first direction; and first and second external electrodes disposed on the body and spaced apart from each other to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein the body includes a side margin overlapping none of the at least one first internal electrode and the at least one second internal electrode in the first direction, and a center width of the side margin is greater than a minimum width of the side margin.

A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, a plurality of external electrodes, an active region including a plurality of internal electrodes, and an additional electrode region including a plurality of additional electrode layers. The plurality of additional electrode layers are connected to an external electrode, among the plurality of external electrodes, different from an external electrode which a most adjacent internal electrode among the plurality of internal electrodes of the active region is connected to, and 1&#x3c;d/e&#x2264;5 in which e is a distance between adjacent internal electrodes among the plurality of internal electrodes and d is a distance between an internal electrode, among the plurality of internal electrodes, and an additional electrode layer, among the plurality of additional electrode layers of the additional electrode region, which are most adjacent to each other.

An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc&#x2264;1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.

Board having multilayer capacitor mounted thereon and multilayer capacitor package

A coil electronic component includes a support substrate; first and second coil patterns disposed on an upper surface and a lower surface of the support substrate, respectively; an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant, wherein at least one portion of a lower surface of the first coil pattern is exposed from the encapsulant, at least one portion of a lower surface of the second coil pattern is exposed from the encapsulant, and the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern.

Coil electronic component

Growing community of inventors

Suwon-si, South Korea

Young Ghyu Ahn