Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Sungkyunkwan University

Young Do Kweon

Seung Wook Park

Jin Gu Kim

Sung Kwon Wi

Young Seuck Yoo

Jong Yun Lee

Hyung Jin Jeon

Ju Hwan Yang

Jin Hyuck Yang

Seon Hee Moon

Kang Heon Hur

Mi Jin Park

Sung Yi

Geon Se Chang

Sang Moon Lee

Joon Seok Kang

Ju Pyo Hong

Hee Kon Lee

Jingli Yuan

Young Ho Kim

Sung Woo Han

Won Chul Sim

Hye Yeon Cha

Hwan Soo Lee

Chang Bae Lee

Young Hee Song

Yoon Su Kim

Christian Romero

Jong Hwan Baek

Seung Wan Shin

Jae Kwang Lee

Young Ghyu Ahn

Kwang Soo Kim

Dong Hwan Lee

Sung Jin Park

Chan Young Yoon

Yong Suk Kim

Jeong Ho Lee

Sung Yong An

Dong Jin Jeong

Jung Min Park

Jeong Min Cho

Young Jae Song

Tae Sang Park

Kyung Seob Oh

Woon Chul Choi

Jong In Ryu

Kyu Jin Lee

Jin Woo Hahn

Jun Hee Bae

Jung Jin Kim

Jang Hyun Kim

Ho Jin Yun

Hyeog Soo Shin

Sung Min Sim

Hong-Won Kim

Hye Won Bang

Hai Jeong Sohn

Hong Won Kim

Su Jeong Suh

Young Jae Lee

Seung Min Baek

Wan Gyan Choi

Jing Li Yuan

Romero Christian

Kwang Keun Lee

Eun Ha Kim

Joung Rhang Lee

Yuan Jing Li

Jae Gwon Jang

Nam Jung Kim

Seung Kyu Lim

An electronic component and a circuit board having the same mounted thereon. The electronic component includes: a base part; a coil part provided on the base part and including a coil formed by disposing conductive patterns in a spiral shape and an external terminal connected to an end portion of the coil; and a cover part including an external electrode having a first surface contacting an upper surface of the external terminal and a second surface opposing the first surface and a magnetic material part provided on the coil part, made of a magnetic material, and exposing the second surface, wherein a surface area of the first surface is larger than a surface area of the second surface.

Electronic component and circuit board having the same mounted thereon

Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.

Common mode filter and method of manufacturing the same

Disclosed herein are a power inductor in which aspect ratios of the innermost pattern and the outermost pattern are similar with those of the intermediate pattern and a manufacturing method thereof. The power inductor includes coil patterns formed on one surface or both surfaces of a core insulating layer; insulating patterns bonded to at least one of an innermost pattern and an outermost pattern of the coil patterns; metal layers plated on surfaces of the coil patterns; and an insulator covering the coil patterns including the metal layers.

Power inductor and manufacturing method thereof

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.

Printed circuit board and method of manufacturing the same

Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.

Thin film type common mode filter

The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.

Inductor and method for manufacturing the same

A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching.

Line width protector printed circuit board and method of manufacturing the same

There are provided a chip embedded board and a method of manufacturing the same. The chip embedded board includes: a core substrate; a first build-up layer formed on one surface of the core substrate and having a cavity formed therein; a chip disposed in the cavity; and an insulating layer filled in the cavity in which the chip is disposed, wherein one surface of the chip is positioned in a circuit layer positioned at the outermost layer of the first build-up layer.

Chip embedded board and method of manufacturing the same

The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.

Via structure having open stub and printed circuit board having the same

Disclosed herein are a coil component and a manufacturing method thereof. The coil component includes: an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a surface thereof; and external terminals formed at both side portions of the electrode body and connected to the coil electrodes, wherein the electrode body is made of an insulating material with which magnetic powders are mixed, in order to improve impedance characteristics.

Coil component and manufacturing method thereof

Disclosed herein is an optical module including: an optical element mounted on a substrate; and an optical connector mounted corresponding to the optical element so as to change a path of an optical signal of the optical element and transfer the optical signal having the changed path. The optical module may provide various communication performances using an optical connector in which first and second connector parts are optically coupled stably to each other. Particularly, the optical module does not have a silicon optical bench (SiOB) as a medium, thereby making it possible to reduce a thickness of a product.

Optical connector and optical module having the same

Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.

Disclosed herein are an asymmetrical multilayer substrate, an RF module, and a method for manufacturing the asymmetrical multilayer substrate. The asymmetrical multilayer substrate includes a core layer, a first pattern layer formed on one side of the core layer and including a first signal line pattern, a second pattern layer formed on the other side and including a second metal plate and a second routing line pattern, a first insulating layer thinner than the core layer formed on the second pattern layer and including a first via, and a third pattern layer formed on the first insulating layer and including a third signal line pattern, wherein an impedance transformation circuit including an impedance load and a parasitic capacitance load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed in the upper and lower side directions of the core layer.

Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate

A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.

Method for manufacturing interposer

The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.

Chip inductor and method for manufacturing the same

Growing community of inventors

Seoul, South Korea

Young Do Kweon