Lg Chem, Ltd

Hanon Systems

Korea Research Institute of Chemical Technology

Young Chan Kim

Chang Bo Shim

Hyuk Joo Kim

Jang Won Seo

Jung Sam Gu

Sang Il Seok

Hee Yong Shim

Hyun Sung Min

Seung Hyun Song

Hyunsung Min

Changbo Shim

Minhyuk Yun

Jun Hong Noh

Nam Joong Jeon

Jae Yong Kim

Jeong Wan Han

Mi Seon Kim

Hwa Yeon Moon

Shin-Won Yun

Won Ki Kim

Yong Seon Hwang

Sang-Il Seok

Gilsang Son

Provided is a cooling module for a vehicle, and more particularly, a cooling module placed on a side of the vehicle with three-row mounting parts, in which components are mounted, to maximize cooling efficiency and space utilization inside the vehicle.

Cooling module placed on side of vehicle

The present invention relates to a thermosetting resin composition for coating a metal film having excellent crack resistance and a metal laminate using the same.

Thermosetting resin composition for coating metal thin film and metal laminate using the same

The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.

The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Resin composition for semiconductor package, prepreg and metal clad laminate using the same

The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Resin composition for semiconductor package, prepreg, and metal clad laminate using the same

A method for manufacturing a device comprising an inorganic/organic hybrid perovskite compound film, according to the present invention, comprises the steps of: a) laminating a first structure and a second structure to allow the first surface layer and the second surface layer to be in contact with each other, the first structure comprising a first surface layer containing at least one of materials i) to v) below, the second structure comprising a second surface layer containing, independently from the first surface layer, at least one of materials i) to v) below; and b) applying heat and physical force to the laminate in which the first structure and the second structure are laminated: i) an inorganic/organic hybrid perovskite compound, ii) an organic halide, iii) a metal halide, iv) an inorganic/organic hybrid perovskite compound precursor, and v) a metal halide precursor.

Method for manufacturing device comprising inorganic/organic hybrid perovskite compound film and device comprising inorganic/organic hybrid perovskite compound film

The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

Thermosetting resin composition for semiconductor package and prepreg using the same

A cooling module is formed by stacking a condenser mounted in order to cool an engine of a vehicle and cool a refrigerant of an air conditioner, an electronic radiator disposed below the condenser, an engine radiator, and a fan shroud assembly and capable of improving cooling performance of the electronic radiator by forming the engine radiator in only a region in which the condenser is formed or forming the engine radiator in a portion of a region in which the electronic radiator is formed as well as the region in which the condenser is formed, in a height direction and including an air guide installed at a portion corresponding to the electronic radiator below the engine radiator to allow air to be introduced toward the electronic radiator.

Cooling module

Growing community of inventors

Daejeon, South Korea

Young Chan Kim