Samsung Electronics Co., Ltd.

Youn-yeol Lee

Wook-Ghee Hahn

Jong-chul Park

Seul-bee Lee

Kyung-sub Lim

Chanho Kim

Kyung-Min Kim

Hyung-Gon Kim

Soo-Woong Lee

Hyuk-Jun Yoo

Jai-ick Son

A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Non-volatile memory device

A memory device includes a peripheral circuit layer, a first memory layer provided on the peripheral circuit layer, an inter-metal layer provided on the first memory layer, and a second memory layer provided on the inter-metal layer. The peripheral circuit layer includes a first substrate and a peripheral circuit provided on the first substrate. The first memory layer includes a first memory structure electrically connected to the peripheral circuit through metal bonding pads. The inter-metal layer includes intermediate pads electrically connected to the peripheral circuit through metal bonding pads. The second memory layer includes a second memory structure electrically connected with the intermediate pads and a second substrate provided on the second memory structure. The peripheral circuit, the first memory structure, and the second structure are provided between the first substrate and the second substrate.

Memory stack with pads connecting peripheral and memory circuits

An operating method of a storage device comprising a nonvolatile memory device comprising a first memory stack and a second memory stack, and a memory controller coupled to control the nonvolatile memory device, the operating method includes determining a first read voltage level with which a first memory cell of the first memory stack is successfully read, and performing a read operation on a second memory cell of the second memory stack using a second read voltage determined based on the first read voltage level.

Nonvolatile memory device and operating method of the same

A nonvolatile memory device includes a first memory stack including first memory cells vertically stacked on each other, a second memory stack including memory cells vertically stacked on each other, and a control logic configured to set a voltage level of a second voltage applied for a second memory operation to one of the second memory cells in the second memory stack based on a first voltage applied to one of the first memory cells in the first memory stack in a first memory operation. The second memory stack is vertically stacked on the first memory stack. Cell characteristics of the one of the first memory cells is determined using the first voltage.

In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Non-volatile memory device and initialization information reading method thereof

A nonvolatile memory device includes a memory cell region including a first metal pad, and a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad. The memory cell region includes a first memory stack comprising first memory cells vertically stacked on each other, and a second memory stack comprising second memory cells vertically stacked on each other. The peripheral circuit region includes a control logic for setting a voltage level of a second voltage applied for a second memory operation to a second memory cell of the second memory cells based on a first voltage applied to a first memory cell of the first memory cells in a first memory operation. Cell characteristics of the first memory cell are determined using the first voltage.

A memory device includes a substrate, a first memory structure including a plurality of first word lines stacked on the substrate in a direction perpendicular to a top surface of the substrate, an inter-metal layer on the first memory structure and including a plurality of intermediate pads connected with separate, respective first word lines of the plurality of first word lines, a second memory structure including a plurality of second word lines stacked on the inter-metal layer in the direction perpendicular to the top surface of the substrate, and an upper metal layer on the second memory structure and including a plurality of upper pads connected with separate, respective second word lines of the plurality of second word lines.

Memory devices with three-dimensional structure

A non-volatile memory device includes an upper semiconductor layer vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group.

A non-volatile memory device may include a memory cell array, a page buffer, a column decoder, a column selection circuit and a repair circuit. The memory cell array includes normal memory cells and redundancy memory cells. In one example, the page buffer may load normal data and redundancy data from the memory cell array. The column decoder may generate a normal column selection signal and a redundancy column selection signal in response to a column address. The column selection circuit may select the normal data and redundancy data in response to the normal column selection signal and redundancy column selection signal. The repair circuit may then output one of the normal data and redundancy data.

Non-volatile memory device and non-volatile memory system having the same

A non-volatile memory device and a bad block remapping method use some of main blocks as remapping blocks to replace a bad block in a main cell block and selects remapping blocks using existing block address signals. Thus, separate bussing of remapping block address signals is not needed. The bad block remapping includes comparing an external block address input from an external source to a stored bad block address, generating a bad block flag signal when the external block address is identical to the stored bad block address, generating a remapping block address selecting the remapping blocks in response to a remapping address corresponding to the bad block address, selecting one of the external block address and the remapping block address in response to the bad block flag signal to create a selected address, and outputting a row address signal in accordance with the selected address.

Growing community of inventors

Seoul, South Korea

Youn-yeol Lee