Samsung Electro-mechanics Co., Ltd.

Youn Sik Jin

Doo Young Kim

Ki Hwan Kim

Dong Won Kim

Hyun Hee Gu

Hae Suk Chung

Jin Hyung Lim

Eun Sang Na

Byung Soo Kim

Ji Hee Moon

Hae Sock Chung

Byung Woo Jeon

Duk Hyun Chun

Kyoung No Lee

Na Rim Ha

Hyun Woo Kim

Hyuk Jin Hong

Byong Gyun Kim

Tae Jin Jang

Hyung Kyu Shim

Hyun Kyu Im

Tae Ok Kim

Tae Young Sung

Jong Beom Shin

A multilayer ceramic capacitor includes: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively, wherein the body includes first dummy patterns formed adjacent to the first internal electrodes in a width direction to be spaced apart from the first internal electrodes, and the first dummy patterns are stacked to partially overlap the second internal electrodes.

Multilayer ceramic capacitor and method of manufacturing the same

Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film.

Multilayer ceramic device

A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrodes facing each other while having the dielectric layer disposed therebetween, and alternately exposed to end surfaces of the ceramic body; first and second external electrodes electrically connected to the first and second internal electrodes, wherein each of the first and second external electrodes includes a first external electrode layer formed of material containing copper and glass and extending from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body; a second external electrode layer formed of material containing glass, disposed on the first external electrode layer, and being shorter than the first external electrode layer to expose portion of the first external electrode layer; and a third external electrode layer formed of material containing copper and glass and covering the first and second external electrode layers.

There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.

Stacked-type multilayer ceramic electronic component, stacked-type multilayer ceramic electronic component module, and method of manufacturing the same

Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.

Stacked chip device and manufacturing method thereof

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Suwon-si, South Korea

Youn Sik Jin