Korea Electronics Technology Institute

Seoul National University

Amkor Technology, Inc.

Other

Youn Sang Kim

Soon Hyung Kwon

Jun Woo Park

Yoon Joo Kim

Bong Chan Kim

Won Keun Kim

Ji Wan Kim

Byung Wook Yoo

Min Suk Oh

Chul Jong Han

Chang Su Kim

Jeongno Lee

Hang-Rae Kim

Byungwook Yoo

Jeong No Lee

Bokyung Kim

Jin-Hee Kim

Jiwan Kim

The present disclosure relates to a culture scaffold for promoting differentiation from stem cells or precursor cells into osteoblasts, in which the culture scaffold includes a structure composed of a ridge and a groove, a kit using the culture scaffold, and a method for differentiating stem cells or precursor cells into osteoblasts. The culture scaffold of the present disclosure has an optimal pattern depending on the type of stem cells or precursor cells, thereby improving the osteoblast differentiation potency. In particular, it has a feature of showing excellent osteoblast differentiation potency even if only a small amount of supplementary factors inducing osteoblast differentiation is added. Furthermore, since the osteoblast differentiation potency is not greatly influenced by the change in cell density, it is possible to induce differentiation into osteoblasts without being influenced by the inflammatory environment formed by the inflammatory factors that increase upon cell differentiation. Thus, there is an advantage in that the differentiation efficiency into osteoblasts is high. Accordingly, the culture scaffold of the present disclosure having excellent bone regeneration ability can be utilized in various biomedical and medical fields such as dental implants, artificial joints and trauma fixation devices.

Culture scaffold for enhancing differentiation of osteoblast using pattern

The present invention relates to an energy conversion substrate using a liquid and, more specifically, to an energy conversion substrate using a liquid capable of converting mechanical energy into electric energy through a flow of a liquid on a substrate having an energy conversion layer. Thus, the present invention enables easy manufacture and easy liquid circulation to be obtained by implementing an energy conversion device using a liquid through one substrate instead of a pair of opposing substrates and can implement the energy conversion device without a lubricating layer.

Energy conversion substrate using liquid

The present invention relates to a method and a device for converting energy using a change of a contact area and a contact angle of liquid and, more specifically, to a method and a device for converting mechanical energy into electric energy by applying a reciprocal phenomenon of electrowetting, wherein liquid and gas are positioned between two facing substrates and energy is converted by using a volume change of a fluid, such that the present invention has the advantages of preventing channel-blocking without requiring all facing electrodes to be patterned, simplifying a device configuration, implementing easy control, and removing the need to apply an external power source.

Energy conversion device using change of contact area and contact angle of liquid

The present invention relates to a flexible energy conversion device using a liquid, and more specifically, to a method and a device for converting mechanical energy into electric energy by applying an opposite phenomenon of electrowetting, which can change a surface contacting the liquid between one pair of electrodes, and use the change of the surface contacting the liquid to generate electric energy, so as to prevent channel blocking or so that a lubricating layer or electrodes patterned onto a channel in a complicated manner are not required, thereby enabling simplification of the device, reduction of manufacturing cost, and the energy conversion device that is less faulty.

Flexible energy conversion device using liquid

The present invention relates to an energy conversion device using a liquid and, more specifically, to a method and a device for converting mechanical energy into electrical energy by applying an opposite phenomenon to an electrowetting phenomenon. The contact surface with liquid is being changed within a pair of electrodes, and the resulting change in the contact surface with liquid is being utilized for generating electrical energy. The device can be simplified and the manufacturing cost thereof is being reduced, furthermore it is effective in implementing an energy conversion device that is less faulty, by preventing channel blocking phenomenon and not requiring a lubricating layer or an electrode complicatedly patterned on a channel. Besides, it is advantageous in that a flexible device can be realized and a large area application is facilitated by simplifying the device structure.

Energy conversion device using liquid

The present invention relates to an energy conversion device using a change of a contact surface with liquid and, more specifically, to a method and a device for converting mechanical energy into electrical energy by applying an opposite phenomenon to an electrowetting phenomenon. The energy conversion device having a simplified structure and reduced manufacturing costs with minimal malfunctions by changing a contact surface with liquid between a pair of electrodes and using the change of the contact surface with the liquid to generate electrical energy such that channel blocking can be prevented or a lubricating layer or electrodes complicatedly patterned on a channel are not required.

Energy conversion device using change of contact surface with liquid

Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.

Method of making semiconductor package with adhering portion

Semiconductor package

A semiconductor device has a substrate having first, second, and third surfaces. An electrically conductive pattern is formed on the first surface. A semiconductor die has a bond pad formed on a first surface thereof. A second surface of the semiconductor die is coupled to the first surface of the substrate. A first connection member electrically couples the bond pad and the electrically conductive pattern. A first land has a first, second, and third surfaces. The second surface of the first land is coupled to the first electrically conductive pattern. A first encapsulant encapsulates the first semiconductor die, the first connection member, and the first land such that the first surface of the first land is exposed.

Growing community of inventors

Suwon-si, South Korea

Youn Sang Kim