Samsung Electro-mechanics Co., Ltd.

Youn Kyu Choi

Jae Yeol Choi

Yun Young Yang

Hea Ah Kim

Mi Jung Kang

Hye Ah Kim

Sung Hyung Kang

Eun Sang Na

Dong Hwan Seo

Hyeon Pyo Jeon

Do Won Kang

A power inductor includes a substrate having a through hole in a central portion thereof; a first internal coil pattern and a second internal coil pattern each having a spiral shape and provided on opposite surfaces of the substrate outwardly of the through hole; a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are provided, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof; a first external electrode and a second external electrode provided on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern, respectively; and an anti-plating layer covering the magnetic body between the first external electrode and the second external electrode.

Power inductor and method of manufacturing the same

A magnetic composition includes: coarse powder containing a non-crystalline iron-based material; medium powder containing a crystalline iron-based material; and fine powder containing nickel. A ratio of the coarse powder and the medium powder is in a range of 65:35 to 80:20, and the amount of the fine powder is in a range of 3 wt % to 7 wt % on the basis of a total weight of the coarse powder and the medium powder.

Magnetic composition and inductor including the same

There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.

Chip electronic component and manufacturing method thereof

A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 &#x3bc;m to 10 &#x3bc;m.

Chip electronic component

Disclosed herein is a method of deagglomerating ceramic powder to inhibit agglomeration and provide a uniform particle size, a deagglomeration mill used for the above method, and a method of preparing uniformly mixed ceramic slurry using the deagglomerated ceramic powder. The deagglomeration method of the ceramic powder includes loading a mixture of ceramic powder and solvent into the deagglomeration mill which includes a hollow cylindrical mill cover having a diameter larger than a length and having a plurality of beads therein; rotating an impeller of a main shaft disposed longitudinally at an internal center portion of the mill cover at a peripheral velocity of 6&#x2013;10 m/s, using a driving means; deagglomerating the ceramic powder by the action of beads which are moved by a rotational force of the impeller; and discharging the mixture of ceramic powder and solvent from the deagglomeration mill.

Method of deagglomerating ceramic powder, deagglomeration mill used therefor and method of preparing highly dispersed slurry using the deagglomerated powder

Growing community of inventors

Suwon-si, South Korea

Youn Kyu Choi