Samsung Electronics Co., Ltd.

Youn-jo Mun

Sung-Il Cho

Sang-Young Kim

Hoon Sohn

Byung-ho Kim

Seung-Weon Ha

Man-hee Han

Jin-Yeol Yang

Byong-gook Jeong

Yun-Kyu An

Jeong-cheol An

Soon-Kyu Hwang

Dae-sang Chun

A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.

Method of singulating semiconductor die and method of fabricating semiconductor package

A surface inspection apparatus and method of inspecting chip surfaces includes a laser generator that generates a periodic CW laser and is transformed into an inspection laser beam having a beam size smaller than a surface size of the chip. Thus, the inspection laser beam is irradiated onto a plurality of the semiconductor chips such that the semiconductor chips are partially and simultaneously heated. Thermal waves are detected in response to the inspection laser beam and thermal images are generated corresponding to the thermal waves. A surface image is generated by a lock-in thermography technique and hold exponent analysis of the thermal image, thereby generating surface image in which a surface defect is included. Time and accuracy of the surface inspection process is improved.

Surface inspection apparatus for semiconductor chips

Growing community of inventors

Cheonan-si, South Korea

Youn-jo Mun