Cheil Industries Inc.

Youn Jo Ko

Dong Seon Uh

Jin Kyu Kim

Jang Hyun Cho

Jin Seong Park

Sang Sik Bae

Woo Jin Lee

Kyoung Soo Park

Woo Jun Lim

Bong Yong Kim

Kyung Jin Lee

Kil Yong Lee

Hye Su Ki

Ie Ju Kim

An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160&#xb0; C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.

Electronic device

An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, wherein the anisotropic conductive film has an electrical conductivity of more than 0 &#x3bc;S/cm to about 100 &#x3bc;S/cm.

Anisotropic conductive film, composition for the same, and apparatus including the same

An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the anisotropic conductive film has a halogen ion content of more than 0 ppm to about 100 ppm.

A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a binder resin; a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof; and conductive particles, the anisotropic conductive film having a moisture permeability of 170 g/m/24 hr or less and a moisture absorbency of 2% or less.

Semiconductor device connected by anisotropic conductive film having a reliability adhesive strength

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

Semiconductor device bonded by an anisotropic conductive film

An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the binder part having an ion content of more than 0 ppm to about 100 ppm.

Growing community of inventors

Uiwang-si, South Korea

Youn Jo Ko