Samsung Electronics Co., Ltd.

Youn Gon Oh

Ji Hun Kim

Ho Chan Lee

Seong Pyo Hong

Eun Hee Lee

Sae Yun Ko

Gil Ho Gu

Dong Su Kim

Seong Sil Jeong

Hyun Woo Lee

Sang Min Kim

Young Wook Kim

Sung-hoon Lee

Yong-Jun Ahn

Chul-Jun Park

Gi-Nam Park

Jeong Hun Lim

Sang Hyuk Park

Hyeong Seok Choo

Seung Gu Bang

Byung Kook Yoo

Provided is a tray including a plate including a first region and a second region, a first groove on the first region of the plate and to which a stub is fixed, and a second groove on the second region of the plate and to which a grid holder is fixed, wherein the stub is configured to store test wafer pieces, and wherein the grid holder is configured to store a test sample.

Tray and destructive analysis automation apparatus including the same

Provided is an equipment front end module (EFEM) including a base configured to communicate with a processor, a tray port on the base, the tray port being configured to load a tray including a stub and a grid holder, a working robot configured to move in a direction on the base, and grasp and convey the stub in the tray and the grid holder in the tray, and a shuttle port on the base, the shuttle port including a first groove configured to fix the stub, and a second groove configured to fix the grid holder, wherein the working robot is further configured to convey the stub to the first groove and convey the grid holder to the second groove.

Equipment front end module and destructive analysis automation apparatus including the same

A substrate transfer device includes a transfer unit configured to transfer, in a first direction, a carrier in which substrates are stored, an upper interface unit configured to move the transfer unit, a lower interface unit configured to receive the carrier from the transfer unit, and a controller configured to control the upper interface unit and the lower interface unit integrally such that the transfer unit and the carrier move in the first direction at the same time.

Substrate transfer device and substrate transfer method

A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

Substrate analysis apparatus and substrate analysis method

A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.

Substrate transfer system

Growing community of inventors

HWASEONG-SI, South Korea

Youn Gon Oh