Qualcomm Incorporated

Thermal Corporation

Youmin Yu

Dexter Tamio Chun

Stephen A Molloy

Victor Adrian Chiriac

Nelson J Gernert

Mark T North

Min Zhang

Tianhong Cui

Tao Zhang

Longzhong Huang

Xuelin Zhu

Congshun Wang

Taiho Yeom

Terrence W Simon

Vinnee Bharathi A Selvi

Smita Agrawal

Donald Wood

Anthony Ciulla

Stephen Arthur Molloy

A method is provided for heat transfer from a surface to a fluid. The method includes directing a first fluid flow towards the surface in a first direction and directing a second fluid flow towards the surface in a second direction. The first and second fluid flows cooperate to cool the surface.

Heat transfer apparatus and method

Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

Multi-layer heat dissipating apparatus for an electronic device

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San Diego, CA, United States of America

Youmin Yu