Elpida Memory, Inc.

Micron Technology Incorporated

Youkou Ito

Hidehiro Takeshima

Tadashi Koyanagi

Takashi Ohba

Tsutomu Kono

Masayuki Mino

Tomoko Goi

A method of manufacturing a semiconductor device according to one embodiment includes: preparing a semiconductor water which is partitioned into a plurality of first semiconductor chips, the plurality of first semiconductor chips including a first group of first semiconductor chips and a second group of first semiconductor chips; providing a second semiconductor chip over at least one of first semiconductor chips of the first group; providing a sealer on the first semiconductor chips of the second group; and grinding one face of the semiconductor wafer which is on the opposite side from a face on which the second semiconductor chip and the sealer are provided.

Method of manufacturing semiconductor device including grinding semiconductor wafer

A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.

Method of analyzing thermal stress according to filling factor of filler in resin

An intermediate structure for semiconductor devices includes a wiring board, a plurality of semiconductor chips mounted on the wiring board, and a sealing body for collectively sealing the plurality of semiconductor chips and having a region with a different thickness.

Intermediate structure of semiconductor device and method of manufacturing the same

Growing community of inventors

Tokyo, Japan

Youkou Ito