Panasonic Electric Works Co., Ltd.

Panasonic Corporation

Matsushita Electric Works, Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Youji Urano

Takuya Nakatani

Yasuhiro Hidaka

Kazuo Kamada

Mikio Masui

Harunori Kitahara

Yasushi Nishioka

Tomonori Suzuki

Kenichiro Tanaka

Jyuzaemon Iwasaki

Takanori Aketa

Masanobu Yamasaki

Yasunori Ueda

Atsuhiro Saito

Hideki Tanaka

Toshiyuki Tsushio

Hirokazu Kato

Shigeru Dono

Mitsutaka Abe

Yoshiro Goto

Koutarou Yanagi

A method of mounting an LED chip, which is intended to suppress void-generation inside an eutectic bonding without use of flux. This method includes a step of eutectically bonding a first metal layer (e.g., AuSn layer) on a rear surface of the LED chip, with a metal ground layer on a dielectric substrate (mounting member). This method includes a step of providing a second metal layer having the same metal component as the first metal layer, to the top surface of the metal ground layer on a dielectric substrate; and subsequently connecting the LED chip and the dielectric substrate by way of eutectically bond while the dielectric substrate is heated at its bottom surface remote from the metal ground layer to melt the second metal layer by heat source (heater or the like).

Method of mounting LED chip

A light emitting device free from void-generation at a bonding between an LED chip and a metal layer provided on a dielectric substrate. This light emitting device is also free from short-circuit between the closely arranged LED chips. This light emitting device includes a plurality of the LED chips, one dielectric substrate (sub-mount member) which is made of a dielectric substrate for holding the LED chips. The dielectric substrate is formed with a plurality of supporting platforms which respectively holds the LED chips. Each supporting platform is provided with a metal layer which is soldered to the LED chip. The supporting platforms are configured to leave a groove between the adjacent ones of the supporting platforms. Each supporting platform is provided at its side surface with a solder-leading portion made of a material having a solder-wettablity higher than that of the supporting platform.

Light emitting diode device preventing short circuiting between adjacent light emitting diode chips

The LED unitcomprises a plurality of the LED moduleand the heat radiation plate. Each the LED modulecomprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chipto the heat radiation plate.

LED unit

The lighting device () includes an LED chip (), a mounting substrate () mounting thereto the LED chip, an encapsulation member () made of an encapsulating resin material for encapsulation of the LED chip, and a lens () made of a transparent resin material. The lens () is provided in its bottom with a recess () and is secured to the mounting substrate () with the encapsulation member () disposed within the recess (). The encapsulation member () is confined within the recess of the lens of the transparent resin material, which minimizes a difference in the coefficient of linear expansion between the encapsulation member and the surroundings for restraining occurrence of voids in the encapsulation member at a low temperature.

Light emitting device

A lighting device including an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member including a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member including a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.

Light emitting device having heat generating color conversion members

A lighting apparatus with LED includes a metal-made main body; a plurality of LED chip unitseach including an LED chip and a pair of lead terminalselectrically connected to electrodes of the LED chip; and a dielectric layerdisposed between the main bodyand each LED chip unitfor making electrical insulation therebetween as well as bond the same. The circuit boardis formed with a plurality of windowsthrough which the individual LED chip unitsextend respectively with the lead terminals held in electrical contact with the circuit pattern of the circuit board at the circumference of the window, each of the LED chip units being thermally coupled at its bottom face with the main bodythrough the dielectric layer, and the heat generated in the LED chip is conducted to the main body through the dielectric layer without passing through the circuit board.

Lighting apparatus with LEDs

A light-emitting device of the present invention includes: a LED chip; a chip mounting memberhaving a conductive plate (heat transfer plate)one surface side of which the LED chipis mounted on and a conductor patternswhich is formed on the one surface side of the conductive platethrough an insulating partand electrically connected to the LED chip; and a sheet-shaped connecting memberdisposed on the other surface side of the conductive plateto connect the conductive plateto a body of the luminairewhich is a metal member for holding the chip mounting member. The connecting memberis made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting memberhas an electrical insulating property and thermally connects the conductive plateand the bodyof the luminaire to each other.

Light-emitting device

A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.

A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.

LED lighting fixture

A light emitting device, in which an encapsulation resin is disposed at a space confined between an optical member and a mounting substrate. This encapsulation resin is possibly made free from a void-generation therein. In this light emitting device, the optical member can be precisely positioned. An electrode disposed outside a color conversion member is possibly free from an improper solder connection. A ring gate is formed on the top surface of the mounting substrate outside of the optical member, and acts to position the color conversion member. The ring gate acts to prevent an overflowing liquid encapsulation resin from flowing to the electrode provided. The ring gate is provided with a plurality of centering projections which are spaced circumferentially along its inner circumference to position the color conversion member.

Light emitting deviceincludes an LED chip, a mounting substratecarrying the LED chip, a dome-shaped color conversion member, and encapsulation member. Color conversion memberis molded from a transparent resin material and a fluorescent material which is excited by a light emitted from the LED chip to emit a light of a color different from a luminescent color of the LED chip, and is bonded to the mounting substrate to surround LED chip. Encapsulation memberis made of an encapsulation resin material to encapsulate LED chipand bonding wireswithin a space confined between mounting boardand color conversion member. Encapsulation memberis of a convex-shape to have its light output surfacekept in an intimate contact with an internal surface of color conversion member. Since the intimate contact between the convex-lens shaped encapsulation memberand the color conversion member is made without the use of a conventional frame, the light emitting device can restrain the generation of voids in the encapsulation member, and therefore give improved reliability. Moreover, the light output efficiency is also improved.

A hair removing device with a lotion applicator includes a housing, a hair removing head mounted to the housing and adapted to be held against a user's skin for hair depilation or hair epilation, an applicator which dispenses a lotion on the user's skin, a tank holding the lotion and a lotion supply mechanism for supplying the lotion from the tank to the applicator. The lotion supply mechanism includes a regulating device, which regulates an amount of the lotion being dispensed from the applicator. The lotion supply mechanism includes a powered pump for expelling the lotion from the tank to the applicator. The regulating device includes a handle for varying pump capacity of the powered pump. The applicator is incorporated into a head frame forming a part of the hair removing head with the head frame being detachable from the housing.

Hair removing device with a lotion applicator

An electroactive polymer actuator, which has the capability of improving response speed and operation reliability of a device utilizing an electroactive effect, comprises a laminate formed by alternately placing a plurality of ring members of an electroactive polymer material having different diameters and a plurality of ring electrodes having different diameters such that each of the ring members is positioned between inner and outer peripheral surfaces of adjacent ring electrodes, and a voltage applying unit for applying a voltage(s) between odd-numbered ring electrodes and even-numbered ring electrodes in the case of counting the ring electrodes in order from an innermost ring electrode of the laminate, to thereby cause a deformation in the laminate. This actuator is preferably used as a diaphragm drive unit of a diaphragm pump.

Electroactive polymer actuator and diaphragm pump using the same

An automated part assembly machine has a work table supported to a base and movable relative thereto and at least two separate robots each having an end effector movable around within an individual work region. The two robots are positioned in such a relation as to give a common work region in which the individual work regions of the two robots overlap. A parts supply is arranged to the work table for storing parts to be picked-up by the robots. A plurality of operator hands are selectively and removably attached to the end effector of the robot for handling the parts by the robot. Disposed within the common region is a jig which positions the parts for assembly by the robot. The robots and the work table are controlled to operate in cooperation for assembly of the parts. The machine is characterized in that the robots are mounted on the movable work table together with the operator hands and the jig with the robots spaced in the moving direction of the work table, and that the parts supply extends in the moving direction of the work table. Thus, the robots are enabled to move together with the jig and the operator hands relative to the parts supply so that the robots can reach over a wide range of the parts supply beyond the individual work regions to thereby successfully pick-up suitable parts and transfer them to the jig for immediate assembly of the parts. Further, since the operator hands are on the movable work table, the robot can change the operator hands while moving relative to the parts supply for effecting the part assembly substantially without interruption, in addition to the advantage of enabling one robot to change the operator hand while the other robot is handling the parts.

Growing community of inventors

Ikeda, Japan

Youji Urano