Kyocera Corporation

Youji Furukubo

Toshifumi Higashi

Masanori Okamoto

Sentarou Yamamoto

Takafumi Yamaguchi

Sentaro Yamamoto

Noriaki Hamada

Yuhei Matsumoto

Takeshi Kawakami

Masahiko Higashi

Katsuaki Masaki

Shinya Kawai

Yoshihiro Nakao

Hideto Yonekura

Kenichi Nagae

Yuji Iino

Masanari Kokubu

Takehiro Nishimura

Kazuki Nishimoto

Kouichirou Sugai

Aki Kitabayashi

Kazuya Shibata

Masanori Annoura

Akira Imoto

Kazuhiro Okamoto

A joint body of the present disclosure includes a substrate including a base member having insulating properties and a metal layer positioned on a first main surface of the base member, a metal joint layer, and a metal member. The metal joint layer is positioned between the metal layer and the metal member of the substrate. The metal joint layer includes a nickel layer, a solder layer, and a composite layer containing a mix of nickel and solder. The nickel layer, the composite layer, and the solder layer are positioned in this order from the metal layer side to the metal member side. The nickel in the composite layer extends from the nickel layer in the thickness direction and forms protrusions and recesses.

Joint body and light source device

An electronic element housing package includes a bottom substrate, a bank portion, and a conductor part, in which the bottom substrate and the bank portion are an integrated object made of ceramic, the bottom substrate includes a region surrounded by the bank portion as a mounting portion for mounting an electronic element, the conductor part includes a first conductor, a second conductor, and a third conductor, the first conductor is partially exposed on a mounting surface of the bottom substrate and embedded in the bottom substrate, at least a part of the third conductor is disposed on an upper surface of the bank portion and a part thereof is exposed, and the second conductor is present between the first conductor and the third conductor inside the bottom substrate and the bank portion and electrically connects the first conductor and the third conductor.

Electronic element housing package and electronic apparatus

A substrate for mounting a light-emitting element includes a substrate that is composed of a ceramic(s), a terminal for an element that is provided on a front surface of the substrate where a light-emitting element is mounted thereon, a terminal for a power source that is provided on the substrate where an external power source is connected thereto, and a wiring part that is provided inside the substrate and electrically connects the terminal for an element and the terminal for a power source. Furthermore, the wiring part includes a first conductor that extends in a surface direction of the substrate and a second conductor that extends substantially parallel to the first conductor on an opposite side of the front surface and is connected in parallel with the first conductor.

Substrate for mounting a light-emitting element and light-emitting device

A substrate for mounting a light-emitting element includes a base and a dam part. The base includes a front surface and a back surface that are principal surfaces thereof where the front surface includes a mounting part that is capable of mounting a light-emitting element thereon. The dam part is arranged on a peripheral part of the front surface to surround the mounting part. The front surface is inclined relative to the back surface at a predetermined angle. The dam part is provided with an opening part at a site where the front surface is inclined to decrease a thickness of the base, in the peripheral part of the front surface. A site of the dam part where the opening part is provided is inclined relative to the back surface in a direction of the front surface.

Substrate for mounting a light-emitting element, array substrate, and light-emitting device

A substrate for mounting an electronic component according to an aspect of an embodiment includes a base that is a plate-shaped body, where a first surface of the base is sloped relative to a second surface that is opposed to the first surface, and when the base is bisected into a lower part and a higher part in a slope direction thereof, a thermal conductivity of the lower part is higher than a thermal conductivity of the higher part.

Substrate for mounting an electronic component, electrical device, and light-emitting device

A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Electrical element mounting package, array package, and electrical device

A wiring board includes: a base material including, on one side of the base material, a protruding part that protrudes toward an outside, wherein the protruding part has a shape in which a center portion of a principal surface rises from the outer periphery, and a plurality of external connection terminals is arranged on the principal surface. A composite substrate includes: the above-mentioned wiring board and a metallic frame member, wherein the frame member includes an opening whose shape is corresponding to a shape in a plan view of the protruding part, and the frame member is arranged such that the opening surrounds the protruding part to fill a periphery of the protruding part. An electric device includes: an electric element on a right face of the wiring board.

Wiring board, composite substrate, and electric device

A substrate for mounting a light-emitting element includes a substrate with a plate shape and a base that protrudes from a front surface of the substrate, wherein the base has a mounting part for mounting a light-emitting element on a top surface thereof and composes a sloping surface that slopes with respect to the front surface and the substrate and the base are integrally formed of a ceramic.

Substrate for mounting a light-emitting element and array substrate, and light-emitting device

A lighting device for a vehicle includes a lighting device body that has a light source part and a housing body that supports the light source part, and a ventilation part-adjacent to the lighting device body and through which outside wind passes. The light source part has a light source element part that emits light and a heat release member that releases heat that is generated in the light source element part. The light source element part is inside of the housing body and the heat release member is exposed inside of the ventilation part.

Lighting device for a vehicle and vehicle

A light-emitting-element housing member includes: a bottom base material having a first surface, and a mounting part on the first surface on which a light emitting element is to be mounted; and a frame member that includes side walls erected on the first surface to surround the mounting part, and an opening that penetrates through one of the side walls. The opening includes an inner edge having a first side and a second side, the first side extends along the first surface and is arranged at a position close to the bottom base material, and the second side extends along the first surface and is arranged at a position far from the bottom base material, and the second side is longer than the first side. An array of the plurality of light-emitting-element housing members, and a light emitting device are also described.

Light-emitting-element housing member, array member, and light emitting device

A light-emitting element housing member includes a substrate that is made of a ceramic and internally includes a deep-bottom-type space portion having an opening in at least one position thereof, wherein an inner wall of the space portion serves as a mounting part for a light-emitting element. A light-emitting element housing member includes a mounting part meant for mounting a light-emitting element and includes a substrate that includes a bottom base material having a rectangular shape in a planar view and a wall member provided on the bottom base material to enclose the mounting part in a U-shaped manner and have an opening in at least one portion thereof, wherein the substrate is integrally formed of a ceramic.

Light-emitting element housing member, array member, and light-emitting device

The present invention includes: a substrate, a rectangular frame-shaped substrate bank sectionprovided on the substrateand including four corner portionsA, and a metal layerprovided on a top surfaceAa of the substrate bank section. A top surfaceAa of the corner portionsA of the substrate bank sectionmay have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layerprovided on the substrate bank sectionof the electronic component storage substrate.

Electronic component storage substrate and housing package

A glass ceramic sinter is disclosed. The glass ceramic sinter includes a glass matrix, and anorthite grains, fersmite grains and quartz grains, all of which are in the glass matrix. A total content of the glass matrix, the anorthite grains, the quartz grains, and the fersmite grains is 98% or more by mass of the glass ceramic sinter.

Glass ceramic sinter, reflective member and substrate for mounting a light-emitting-element, and light-emitting device

A laminated wiring board comprising: The laminated wiring board offers a high degree of mounting reliability even when it is interposed between the electric device such as a silicon semiconductor device having a small coefficient of thermal expansion and an external circuit board such as a printed board having a large coefficient of thermal expansion.

Laminated wiring board and its mounting structure

According to the present invention, there is provided a method of marking a ceramic member, which comprises firing, in an atmosphere, a ceramic green body containing at least 0.05% by weight of a color changing agent capable of developing different color tones by heating in different atmospheres, and heating a specific portion of the resulting sintered body in the other atmosphere to form a marking portion whose color tone is different from that of the other portion, and a marked ceramic member, thereby making it possible to easily form a mark having excellent visibility in a short time without increasing the number of processes.

Growing community of inventors

Kirishima, Japan

Youji Furukubo