Jsr Corporation

Youichirou Maruyama

Noboru Oshima

Takahiko Kurosawa

Katsutoshi Sawada

Kaori Shirato

Syouei Tsuji

A method of forming a cavity between metallic wirings using a polymer capable of revealing a specific heat resistant temperature and a specific heat decomposition temperature by having a specific repeating unit structure and a specific molecular weight range and of readily forming a cavity structure between metallic wirings in, for example, semiconductors. The method comprises a step of coating the surface of a first dielectric film formed on a semiconductor substrate with a cyclic olefin based addition polymer, a step of patterning the cyclic olefin based addition polymer as a void-forming polymer, a step of forming a metallic wiring in the pattern formed on the void-forming polymer, a step of forming a second dielectric film on the void-forming polymer containing a metallic wiring, and a step of removing the void-forming polymer between the multilayered wirings by heating to form a cavity between the metallic wirings.

Method of forming cavity between multilayered wirings

An olefin copolymer having a functional group and having a structural unit (a) derived from ethylene, a structural unit (b) derived from an &agr;-olefin having 3 to 12 carbon atoms, and a structural unit (c) derived from a cycloolefin, exhibits an intrinsic viscosity &lsqb;&eegr;&rsqb; of 0.1 to 10 dl/g as measured in decalin at 135&deg; C. and can be used in a rubber composition.

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Tokyo, Japan

Youichirou Maruyama