Matsushita Electric Industrial Co., Ltd.

Youichiro Ueda

Toshihiko Tsujikawa

Kazuhiro Ikurumi

Kenji Okamoto

Seiji Mizuoka

Masanori Yasutake

A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.

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Takatsuki, Japan

Youichiro Ueda