Seiko Epson Corporation

Youichi Kodaira

Hiroshi Kuriyama

Kozo Gyoda

Haruyuki Miyasaka

Hideki Horiuochi

A stamp making unit is provided having a structure such that gel photosensitive resin for forming a stamping surface can be protected appropriately and non-cured portions of the photosensitive resin can easily be removed after the stamping surface has been formed. A package capable of satisfactorily storing a stamp making unit of the foregoing type is also provided. The stamp making unit uses photosensitive resin as a base material for forming a stamping surface of a stamp which changes from a gel state to a solid state due to received light. The stamping unit comprises a stock member, photosensitive resin bonded to a surface of the stock member on which the stamping surface is formed and a cover member bonded to a surface of the photosensitive resin having light transmission properties. Adhesion between the photosensitive resin in the gel state and the stock member is weaker than adhesion between the photosensitive resin in the gel state and the cover member. Also, adhesion between the photosensitive resin in the solid state and the stock member is stronger than adhesion between the photosensitive resin in the solid state and the cover member.

Stamp making unit and package therefor

Stamp material, stamp making method using the stamp material and stamp

A stamp unit and a method of preparing the same are provided in which a liquid photosensitive resin is used as the base material for stamp formation and the ease with which the material is handled during transportation, storage and stamp formation is facilitated. The stamp unit uses a liquid photosensitive resin which changes from liquid to solid upon receiving rays of light as the base material for stamp face formation. The stamp unit also includes a stamp stock, a liquid resin encapsulating section which is provided on the stamp face formation side of the stamp stock and which serves to encapsulate the liquid photosensitive resin in a state in which the resin can be exposed, an injection hole having one end open to the encapsulating space of the liquid resin encapsulating section and a second end open to the exterior, and a stopping member for stopping the injection hole to seal the liquid photosensitive resin in the liquid resin encapsulating section, wherein the liquid resin encapsulating section is constructed such that at least that portion thereof which covers the stamp face can be removed after stamp face formation.

Growing community of inventors

Suwa, Japan

Youichi Kodaira