Fujitsu Corporation

Transphorm Japan, Inc.

Youichi Kamada

Shirou Ozaki

Kenji Kiuchi

A semiconductor device includes a substrate; a first semiconductor layer and a second semiconductor layer, both including a nitride semiconductor; a gate electrode; a source electrode; a drain electrode formed on the second semiconductor layer; and a first insulating film and a second insulating film formed on the second semiconductor layer. The first insulating film is formed on a gate-electrode side and the second insulating film is formed on a drain-electrode side between the gate electrode and the drain electrode. A part of the gate electrode is formed on the first insulating film. The first insulating film and the second insulating film are formed of silicon nitride. The Si&#x2014;H bond density in the first insulating film is higher than that in the second insulating film. The N&#x2014;H bond density in the second insulating film is higher than that in the first insulating film.

Semiconductor device, method for producing semiconductor device, power supply device, and amplifier

A compound semiconductor device includes: a carrier transit layer; a carrier supply layer over the carrier transit layer; a source electrode and a drain electrode above the carrier supply layer; a gate electrode above the carrier supply layer between the source electrode and the drain electrode; and a first insulating film and a second insulating film above the carrier supply layer between the gate electrode and the drain electrode. The gate electrode includes a portion above the second insulating film, the second insulating film covers a side surface of the first insulating film from the drain electrode side, and a second concentration of electron traps in the second insulating film is higher than a first concentration of electron traps in the first insulating film.

Compound semiconductor device and method of manufacturing the same

A compound semiconductor device includes: a carrier transit layer; a carrier supply layer over the carrier transit layer; a source electrode and a drain electrode above the carrier supply layer; a gate electrode above the carrier supply layer between the source electrode and the drain electrode; and a first insulating film, a second insulating film, and a third insulating film above the carrier supply layer between the gate electrode and the drain electrode. The gate electrode includes a portion above the third insulating film, a first concentration of electron traps in the first insulating film is higher than a second concentration of electron traps in the second insulating film, and a third concentration of electron traps in the third insulating film is higher than the second concentration of the electron traps in the second insulating film.

A semiconductor device includes an electrode material diffusion suppression layer provided either between a gate electrode and a gate insulation film, between Al-containing ohmic electrodes and an Au interconnection, and below the gate electrode and above the Al-containing ohmic electrodes, the electrode material diffusion suppression layer having a structure wherein a first the TaN layer, a Ta layer, and a second the TaN layer are stacked in sequence.

Semiconductor device and method of manufacturing the same, and power supply apparatus

A compound semiconductor device includes: a substrate; an electron transit layer and electron supply layer formed over the substrate; a gate electrode, source electrode, and drain electrode formed over the electron supply layer; and a first Fe-doped layer provided between the substrate and the electron transit layer in a region corresponding to the position of the gate electrode in plan view, the first Fe-doped layer being doped with Fe to reduce two dimensional electron gas generated below the gate electrode.

Compound semiconductor device and method for manufacturing the same

An AlGaN/GaN HEMT includes: a compound semiconductor layer; a source electrode and a drain electrode formed on an upper side of the compound semiconductor layer; and an Al&#x2014;Si&#x2014;N layer being a high-resistance layer disposed in a lower portion of at least one of the source electrode and the drain electrode and higher in an electric resistance value than the source electrode and the drain electrode.

An embodiment of a compound semiconductor device includes: a substrate; an electron channel layer and an electron supply layer formed over the substrate; a gate electrode, a source electrode and a drain electrode formed on or above the electron supply layer; a first p-type semiconductor layer formed between the electron supply layer and the gate electrode; and a second p-type semiconductor layer formed between the electron supply layer and at least one of the source electrode and the drain electrode. The one of the source electrode and the drain electrode on the second p-type semiconductor layer includes: a first metal film; and a second metal film which contacts the first metal film on the gate electrode side of the first metal film, and a resistance of which is higher than that of the first metal film.

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Yamato, Japan

Youichi Kamada