Nitto-denko Corporation

Dai Nippon Printing Co., Ltd.

You Shimazaki

Masachika Masuda

Chikao Ikenaga

Kazuhito Hosokawa

Takuji Okeyui

Kazuhiro Ikemura

Keisuke Yoshikawa

A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive padson an adhesive layer included in an adhesive sheet, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheetwith surfaces thereof not provided with any electrodes in contact with the adhesive sheet, and electrically connecting electrodesformed on the semiconductor chipsand upper parts of the conductive padswith wires. The semiconductor chips, the wiresand the conductive padsare sealed in a sealing resin molding, and then the adhesive sheetis separated from the sealing resin molding. Each of the conductive padshas a reduced part, and a jutting partjutting out from the reduced part. The conductive padshaving such construction can be firmly bonded to the sealing resin molding

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Growing community of inventors

Tokyo-to, Japan

You Shimazaki