Kabushiki Kaisha Shinkawa

You Kawamoto

Toshimichi Miyahara

Yuu To

A wire bonding apparatus including a joining machine unit for joining a wire to a subject device, a measurement unit for measuring the connection state between the subject device and the wire, and a control unit for controlling the operation of the entire apparatus. An AC-C measurement circuit of the measurement unit includes an AC power supply, an equivalent capacitance circuit that creates an essentially the same capacitance as the capacitance component of the joining machine unit before bonding, a differential circuit that finds the difference between the capacitance of the joining machine unit after bonding and the capacitance of the equivalent capacitance circuit, an amplification circuit, a rectification circuit, an AID conversion circuit, a judgment unit that judges the connection state, and an output unit.

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Oume, Japan

You Kawamoto