Samsung Electronics Co., Ltd.

You-Cheol Shin

Jung-Dal Choi

Kyu-Charn Park

Jong-woo Park

Yong-Sik Yim

Won-Hong Lee

Hong-Suk Kwack

A shallow trench isolation type semiconductor device is described, which includes a trench having a flexure in a bottom thereof. The flexure has a step difference of about 100 &#x212b; or more, and is preferably made at a middle area. Conventionally, a gate insulating layer includes a thin area of about 100 &#x212b; or less and a thick area of about 200 &#x212b; or more. On the basis of a bottom of a trench peripheral region, a middle part of the flexure may be concave or convex. Particularly, the foregoing device can effectively be applied to a self-aligned flash memory in which a width of a trench between one active region and another is about 3 micrometers or less.

Shallow trench isolation type semiconductor device and method of forming the same

A semiconductor device comprises a plurality of gate lines composed of line shapes to function as gate electrodes in a plurality of transistors and separated from a substrate by a gate insulating layer, each having an upper metal silicide layer; and a plurality of source/drain regions formed on the substrate between said gate lines solely by carrying out impurity implantation processes.

Semiconductor device and method of manufacturing the same including forming metal silicide gate lines and source lines

A flash memory having a charge-storage dielectric layer and a method for forming the same are provided. According to one embodiment, charge-storage dielectric layers are formed over the first and second active regions. The charge-storage layer over the first active region is not connected to the charge-storage layer over the second active region. A gate line overlies the charge-storage layer and extends across the first and second active regions and the isolation region. The charge-storage layer can be formed only where a gate line intersects an active region of a semiconductor substrate, not on an isolation region. Thus, undesirable influence or disturbance from adjacent memory cells can be avoided.

Flash memory device and a method for fabricating the same

A flash memory having a charge-storage dielectric layer. According to one embodiment, charge-storage dielectric layers are formed over the first and second active regions. The charge-storage layer over the first active region is not connected to the charge-storage layer over the second active region. A gate line overlies the charge-storage layer and extends across the first and second active regions and the isolation region. The charge-storage layer can be formed only where a gate line intersects an active region of a semiconductor substrate, not on an isolation region. Thus, undesirable influence or disturbance from adjacent memory cells can be avoided.

Flash memory device with isolation regions and a charge storage dielectric layer formed only on an active region

A non-volatile memory device having a MONOS (Metal-oxide-nitride-oxide-semiconductor) gate structure is provided. This device includes a selection transistor and a cell transistor including a cell gate insulation layer formed in a cell array area and a low-voltage MOS transistor having a low-voltage gate insulation layer and a high-voltage MOS transistor having a high-voltage gate insulation layer formed in a peripheral circuit area. The low-voltage gate insulation layer is thinner than the high-voltage gate insulation layer. The low-voltage gate insulation layer can also be thinner than the equivalent thickness of the cell gate insulation layer.

Non-volatile memory device having a metal-oxide-nitride-oxide-semiconductor gate structure

Embodiments of the invention provide a method that includes forming a selection transistor and a cell transistor that includes a cell gate insulation layer in a cell array area. The method also includes forming a low-voltage MOS transistor having a low-voltage gate insulation layer and a high-voltage MOS transistor having a high-voltage gate insulation layer in a peripheral circuit area. The low-voltage gate insulation layer is formed thinner than the high-voltage gate insulation layer. The low voltage gate insulation layer may also be formed thinner than the equivalent thickness of the cell gate insulation layer.

Growing community of inventors

Kyunggi-do, South Korea

You-Cheol Shin