Sony Semiconductor Solutions Corporation

Sony Corporation

Ricoh Company, Ltd.

Sony Group Corporation

Japan Aviation Electronics Industry, Limited

Toshiba Lighting & Technology Corporation

Fdk Corporation

Samsung Electronics Co., Ltd.

Nec Corporation

Murata Manufacturing Co., Ltd.

Lintec Corporation

Yosuke Saito

Masahiro Joei

Shintarou Hirata

Yuta Hasegawa

Kenichi Murata

Iwao Yagi

Masashi Bando

Fumihiko Koga

Keisuke Sugiyama

Hideaki Togashi

Osamu Enoki

Yoshiaki Obana

Hitoshi Kawano

Nobuyuki Matsuzawa

Toshiki Moriwaki

Hirokatsu Suzuki

Yukio Kaneda

Kazumasa Takeshi

Ichiro Takemura

Yasuharu Ujiie

Masatoshi Kumagai

Koji Takahashi

Yuji Takahashi

Hideki Ono

Kenji Kitamura

Masanori Kawasumi

Yukiko Sato

Hirokazu Otake

Tatsuya Konishi

Shinichiro Yamada

Kazuaki Kamihara

Sho Asano

Hideaki Mogi

Noriyuki Kitamura

Norikazu Nakayama

Seiichiro Tabata

Yasushi Akiba

Shotaro Takeuchi

Masahiko Kamata

Shinichiro Matsumoto

Koichiro Hinokuma

Takashi Kawashima

Michinori Shiomi

Daisuke Hobara

Yoshifumi Kubota

Toshio Nishi

Hironori Iida

Jong-Sun Kim

Akinori Sato

Ruki Midorikawa

Takaya Ochiai

Yuki Negishi

Naoki Takai

Yuichiro Kato

Masato Kanno

Hideyuki Ohtani

Kazuki Shimodate

Shota Yoshida

Yoshiyuki Hirano

Daisuke Mezaki

Hiroshi Terasaka

Naoko Iwai

Yuki Tsuchiya

Shingo Takahashi

Ryosuke Suzuki

Sae Miyaji

Atsushi Hada

Kiyoteru Kosa

Shun Yamanoi

Kenji Sakai

Kazuhiko Sato

Hajime Kobayashi

Satoru Ishikake

Hideyuki Ootani

Ryusuke Murayama

Hae-Won Ahn

Toru Ishikita

Shigeto Okuji

Hiromichi Nakajima

Miki Kimijima

Akira Furukawa

Kenji Kishimoto

Syuuiti Takizawa

Takeru Bessho

Hideo Kozuka

Takahiko Sugiura

Masataka Nakajin

Shinnosuke Hattori

Hideyo Watanabe

Daiki Marumo

Yusuke Ogawa

Hiroki Atari

Hiroyuki Kudo

Yuki Morita

Makoto Kono

Hiroya Kan

Takao Kowada

Kimie Toda

Hiroyuki Tamura

Kiyotaka Kumamoto

Provided is a solid-state image capturing element including a semiconductor substrate and first and second photoelectric conversion parts configured to convert light into electric charge. The first and the second photoelectric conversion parts each have a laminated structure including an upper electrode, a lower electrode, a photoelectric conversion film sandwiched between the upper electrode and the lower electrode, and an accumulation electrode facing the upper electrode through the photoelectric conversion film and an insulating film. The lower electrode of each of the first and the second photoelectric conversion parts is electrically connected with a common electric charge accumulation part through a common penetration electrode provided in common to the first and the second photoelectric conversion parts and penetrating through the semiconductor substrate, the common electric charge accumulation part being provided in common to the first and the second photoelectric conversion parts in the semiconductor substrate.

Solid-state image capturing element, solid-state image capturing device, and solid-state image capturing element reading method

A sheet laminator includes a fuser pressure member, a heater, a drive device, and circuitry. The fuser pressure member thermally fixes a two-ply sheet and a sheet medium inserted between two sheets of the two-ply sheet. The heater heats the fuser pressure member. The driver rotates the fuser pressure member. In response to a pause of a rotation of the fuser pressure member, the circuitry turns off a power supply to the heater, and perform one of immediately stopping the fuser pressure member or rotating the fuser pressure member and stopping the fuser pressure member after the rotation of the fuser pressure member, based on a state of the fuser pressure member.

Sheet laminator and image forming system incorporating the sheet laminator

The present technology relates to a solid-state imaging element, a method for manufacturing a solid-state imaging element, a photoelectric conversion element, an imaging device, and an electronic apparatus that are capable of realizing highly efficient photoelectric conversion of blue light with organic photoelectric conversion element. A first organic semiconductor having a characteristic of absorbing blue light, a second organic semiconductor having a characteristic of absorbing blue light and a characteristic as a hole-transporting material having crystallinity, and a third organic semiconductor including a fullerene derivative are mixed to form an organic photoelectric conversion layer. The present technology can be applied to a solid-state imaging element.

Solid-state imaging element, method for manufacturing solid-state imaging element, photoelectric conversion element, imaging device, and electronic apparatus

A backup power supply device includes: a storage battery charged with power from an external power supply; charge switches for charging the storage batter; discharge switches that are made from a field-effect transistor and that discharge the storage battery to a load device; a control unit for controlling the charge switches and the discharge switches; and a discharge suppression section connected in series to the discharge switches. The discharge suppression section suppresses leakage of current from the storage battery only when the control unit charges the storage battery, and the battery voltage exceeds an input voltage and the difference voltage between the battery voltage and the input voltage is less than a prescribed value.

Backup power supply device

A photoelectric conversion elementA according to an embodiment of the present disclosure includes: a first electrode; a second electrodethat is disposed to be opposed to the first electrode; and a photoelectric conversion layerthat is provided between the first electrodeand the second electrode. The photoelectric conversion layerincludes a hole transporting material as a first organic semiconductor material. The hole transporting material absorbs blue light.

Photoelectric conversion element and imaging device

An imaging element according to an embodiment of the present disclosure includes: a first electrode including a plurality of electrodes; a second electrode opposed to the first electrode; a photoelectric conversion layer including an organic material provided between the first electrode and the second electrode; a first semiconductor layer provided between the first electrode and the photoelectric conversion layer, and including an n-type semiconductor material; and a second semiconductor layer provided between the second electrode and the photoelectric conversion layer, and including at least one of a carbon-containing compound having an electron affinity larger than a work function of the first electrode or an inorganic compound having a work function larger than the work function of the first electrode.

Imaging element and imaging apparatus

A thermal fixer includes a first thermal fixing roller and a second thermal fixing roller. The first thermal fixing roller includes a first heater. The second thermal fixing roller is pressed to the first thermal fixing roller. The second thermal fixing roller includes a second heater and has a diameter, a rigidity, and a surface releasability substantially identical to the first thermal fixing roller.

Thermal fixer, sheet laminator incorporating the thermal fixer, and image forming system incorporating the sheet laminator

A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode; a second electrode that is opposed to the first electrode; and an organic photoelectric conversion layer that is provided between the first electrode and the second electrode, and includes, as a first organic semiconductor material, a benzothienobenzothiophene-based compound represented by a general formula (1).

To provide a photoelectric conversion element that can improve image quality. Provided is a photoelectric conversion element including at least a first electrode, a work function control layer, a photoelectric conversion layer, an oxide semiconductor layer, and a second electrode in this order, and further including a third electrode, in which the third electrode is provided apart from the second electrode and is provided facing the photoelectric conversion layer via an insulating layer, and the work function control layer contains a larger amount of oxygen than an amount of oxygen satisfying a stoichiometric composition.

Photoelectric conversion element, solid-state imaging device, and electronic device

A sheet laminator includes a fuser pressure member, a conveyor, and a guide. The fuser pressure member thermally fixes a two-ply sheet and a sheet medium inserted between two sheets of the two-ply sheet. The conveyor conveys the two-ply sheet toward the fuser pressure member in a sheet conveyance direction. The guide guides the two-ply sheet in a sheet conveyance passage between the conveyor and the fuser pressure member. At least one of the fuser pressure member or the conveyor is operable to guide the two-ply sheet outside the sheet conveyance passage in response to an occurrence of an abnormal stop of the sheet laminator.

An imaging element according to an embodiment of the present disclosure includes: a first electrode; a second electrode that is disposed to be opposed to the first electrode; and an organic layer that is provided between the first electrode and the second electrode. The organic layer includes a compound represented by a general formula (1).

Imaging element and imaging device

A sheet laminator includes a thermal fixing roller pair, a first heater, a second heater, multiple temperature detectors, and a driver. The thermal fixing roller pair includes a first thermal fixing roller and a second thermal fixing roller facing the first thermal fixing roller. The thermal fixing roller pair thermally fixes and conveys a two-ply sheet and a sheet medium nipped between two sheets of the two-ply sheet. The first heater heats the first thermal fixing roller. The second heater heats the second thermal fixing roller. The multiple temperature detectors are at different positions along an axial direction of the thermal fixing roller pair. The multiple temperature detectors detect a surface temperature of the thermal fixing roller pair. The driver drives the thermal fixing roller pair.

A solid-state imaging element with pixel transistors and wires capable of efficiently outputting and transferring a pixel signal from a stacked photoelectric conversion film while suppressing an increase in manufacturing cost, and a manufacturing method thereof are provided. There is provided a solid-state imaging element which includes a semiconductor substrate; a first photoelectric conversion unit provided on the semiconductor substrate; and a control unit provided stacked with the first photoelectric conversion unit and including a plurality of pixel transistors, in which the first photoelectric conversion unit includes a second electrode, a first photoelectric conversion film provided above the second electrode and converting light into charges, and a first electrode provided on the first photoelectric conversion film, the plurality of pixel transistors include an amplification transistor that amplifies and outputs the charges as a pixel signal, and a channel formation region of the amplification transistor made of an oxide semiconductor layer.

Solid-state imaging element including a plurality of photoelectric conversion units

To provide a photoelectric conversion element capable of further improving performance in a photoelectric conversion element using an organic semiconductor material. The photoelectric conversion element includes a first electrode and a second electrode arranged to face each other, and a photoelectric conversion layerprovided between the first electrode and the second electrode, in which the photoelectric conversion layerincludes a first organic semiconductor material and a second organic semiconductor material, and at least one of the first organic semiconductor material or the second organic semiconductor material is an organic molecule having a HOMO volume fraction of 0.15 or less or a LUMO volume fraction of 0.15 or less.

Photoelectric conversion element

There is provided a solid-state image sensor, a solid-state imaging device, an electronic apparatus, and a method of manufacturing a solid-state image sensor capable of improving characteristics. There is provided a solid-state image sensor including a stacked structure that includes a semiconductor substrate, a first photoelectric converter provided above the semiconductor substrate and converting light into charges, and a second photoelectric converter provided above the first photoelectric converter and converting light into charges, where the first photoelectric converter and the second photoelectric converter include a photoelectric conversion stacked structure in which a common electrode, a photoelectric conversion film, and a readout electrode are stacked so that the first photoelectric converter and the second photoelectric converter are in a line-symmetrical relationship with each other with a vertical plane perpendicular to a stacking direction of the stacked structure as an axis of symmetry.

Solid-state image sensor, solid-state imaging device, electronic apparatus, and method of manufacturing solid-state image sensor

Growing community of inventors

Tokyo, Japan

Yosuke Saito