O.k. Print Corporation

Denso Corporation

Yosuke Ozaki

Koji Kondo

Yoshihiko Shiraishi

Toshikazu Harada

Toshihiro Miyake

Yoshitaro Yazaki

Satoshi Takeuchi

Masayuki Aoyama

Kazuo Tada

Katsumi Yamazaki

Seiji Konishi

Seiichi Shindou

A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board

The present invention relates to a method for manufacturing a printed circuit board The method for manufacturing a printed circuit board of the present invention comprises opening resin holes in a copper plate, filling second resins such as epoxy resins in the resin holes, attaching first metal foils such as copper foils through first resins such as polyimide resins dissolved in solvents on the copper plate, selectively etching the first metal foils, attaching second metal foils through the first resins dissolved in a solvent on both the faces, selectively wet-etching the second metal foils, irradiating laser beam over the resulting thereby exposed first resins to open a connection holes in the second metal foils and resin layers consisting of the first resin, electroless copper plating and subsequent electrolytic copper plating to form copper-plated layers on both the faces, and thereafter selectively etching the second metal foils and the copper-plated layers.

Method for manufacturing a printed circuit board

The present invention relates to a printed circuit board and a printed circuit board base material for use in the printed circuit board. The printed circuit board base material of the present invention is produced by impregnating a carbon core material such as carbon cloth with a first resin such as epoxy resin, and the printed circuit board of the present invention is characterized in that resin pores are opened on the printed circuit board base material, second resins such as epoxy resins are filled in the resin pores, circuit layers are formed on the printed circuit board base material, through holes connecting the circuit layer together are provided, and the center line of the resin pore is approximately in line with the center line of the through hole.

Printed circuit board and printed circuit board base material

Growing community of inventors

Kokubunji, Japan

Yosuke Ozaki