Screen Holdings Co., Ltd.

Yosuke Okuya

Ayumi Higuchi

Shota Iwahata

Eri Fujita

Yoshiyuki Fujitani

Masako Mano

Yusuke Takematsu

A processing liquid supplying apparatus supplies a processing liquid to a processing unit which processes a substrate. The processing liquid supplying apparatus includes a supply pipe to which a processing liquid inside a processing liquid tank that stores the processing liquid is fed and which supplies the processing liquid, which is fed from the processing liquid tank, to the processing unit, a return pipe which is branched and connected to the supply pipe to return a processing liquid inside the supply pipe to the processing liquid tank, a first heating unit which heats a processing liquid inside an upstream-side portion to be heated that is set in the supply pipe upstream from a branched position to which the return pipe is connected, a second heating unit which heats a processing liquid inside a downstream-side portion to be heated that is set in the supply pipe downstream from the branched position, a cooling unit which cools a processing liquid inside a portion to be cooled that is set in the return pipe, and a first filter which is interposed in the supply pipe upstream from the upstream-side portion to be heated and removes particles in a processing liquid.

Processing liquid supplying apparatus, substrate processing apparatus and processing liquid supplying method

The substrate processing apparatus includes first supply piping which guides a processing liquid from a first branching portion to a first chemical liquid nozzle, first return piping which guides the processing liquid from the first branching portion to a tank, a first pressure-loss setting unit which sets a pressure loss so that a pressure loss through the first supply piping is larger than a pressure loss through the first return piping, and a first discharge valve which switches between a first discharge execution state in which the pressure loss through the first return piping is larger than the pressure loss through the first supply piping and a first discharge stop state in which the pressure loss through the first return piping is smaller than the pressure loss through the first supply piping.

Substrate processing apparatus

Growing community of inventors

Kyoto, Japan

Yosuke Okuya