Nippon Light Metal Company, Ltd.

Yosuke Nishikawa

Shinichiro Sumi

Yuichi Tamaki

Kei Iwasaki

Sayuri Shimizu

Manabu Okubo

To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. To solve the problem by providing a conductive member having a Ni plating layeron the surface of contact partsprovided on a substrate, an arithmetic average roughness Sa of the surface of the Ni plating layerbeing 20 nm or more. In the Ni plating layer, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness Hof the Ni plating layeris preferably 5000 n/mmor less.

Conductive member, and production method therefor

A conductive member of the present invention includes: a metallic conductive base material including a joining region to be joined to another conductive member when the conductive member is used; and a conductive-auxiliary-coating-agent layer for imparting conductivity and an oxidation preventing property to a joining section between the joining region and another conductive member when the conductive member is used, the conductive-auxiliary-coating-agent layer being formed by applying a conductive auxiliary coating agent to the joining region of the conductive base material, in which the joining region of the conductive base material has a surface roughness of 0.6 &#x3bc;m or less in terms of an arithmetic mean roughness Ra specified in JISB0601 (1994).

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Shizuoka, Japan

Yosuke Nishikawa