Nitto-denko Corporation

Yosuke Nakanishi

Hironobu Machinaga

Shusaku Shibata

Yutaka Ohmori

Teppei Niino

Takeshi Tanaka

Motoki Haishi

Eri Ueda

Yuuki Takeda

Toshihiro Tsurusawa

Masahiko Watanabe

Kyotaro Yamada

Sho Shibahara

Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.

Wiring circuit board

Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.

An impedance matching filmincludes a metallic element and a non-metallic element. The impedance matching filmhas a thickness of 10 to 200 nm. The impedance matching filmhas a sheet resistance of 200 Ω/□ or more. In the impedance matching film, the content of an oxygen atom is less than 50% in terms of the number of atoms.

Impedance matching film for radio wave absorber, impedance matching film-attached film for radio wave absorber, radio wave absorber, and laminate for radio wave absorber

An impedance matching filmincludes a mixture containing indium oxide and tin oxide and being a main component of the impedance matching film, the mixture having an amorphous structure. The impedance matching filmfor impedance matching has a Hall mobility of 5 cm/(V·s) or more. The impedance matching filmhas a thickness of 16 nm or more and less than 100 nm.

A heat-ray-transmission-controllable, light-transmissive base material is provided that includes a light-transmissive insolation-cutting unit configured to control transmission of light in at least a part of wavelength regions among wavelength regions of visible light and near-infrared light; and a transparent conductive oxide layer disposed over the light-transmissive insolation-cutting unit, containing a transparent conductive oxide.

Heat-ray-transmission-controllable, light-transmissive base material and light-transmissive base material unit

A heater () includes a support () made of an organic polymer and having a sheet shape, a heating element (), and at least one pair of power supply electrodes () in contact with the heating element (). The heating element () is a transparent conductive film made of a polycrystalline material containing indium oxide as a main component. In the heater (), the heating element () has a specific resistance of 1.4&#xd7;10&#x3a9;&#xb7;cm to 3&#xd7;10&#x3a9;&#xb7;cm. The heating element () has a thickness of more than 20 nm and not more than 100 nm.

Heater

Infrared reflecting film includes, on a transparent film substrate, a metal oxide layer, an infrared reflecting layer mainly made of silver, and a light absorptive metal layer, in this order. No metal layer is disposed between the transparent film substrate and the infrared reflecting layer. The metal oxide layer is preferably formed of a composite metal oxide including zinc oxide and tin oxide. The light absorptive metal layer has a thickness of 2 nm to 10 nm and includes at least one selected from the group consisting of nickel, chromium, niobium, tantalum, and titanium.

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Ibaraki, Japan

Yosuke Nakanishi