Panasonic Intellectual Property Management Co., Ltd.

Yosuke Nagasawa

Hideaki Watanabe

Shigeki Imafuku

Dai Yokoyama

Yew Song Danny Ng

Yet Ling Loh

Satoshi Matsuoka

Kazuo Nagae

Kian Hong Lam

Jintao Huang

A component supply device includes a transport path that guides a component connected body from a component insertion port on an upstream side in a component feeding direction to a component supply position on a downstream side, the component connected body including a plurality of axial components arranged and connected at a predetermined pitch, the plurality of axial components each having a lead, and a feed mechanism that pitch-feeds the component connected body along the transport path to the downstream side. The feed mechanism includes a feed member which has a plurality of feed hooks disposed at the predetermined pitch along the component feeding direction, a rotating shaft which is connected to one end side of the feed member, and a moving mechanism which is connected to the feed member through the rotating shaft and reciprocates the rotating shaft along the component feeding direction. A length of one feed hook among the plurality of feed hooks is longer than a length of an other feed hook among the plurality of feed hooks, the other feed hook being adjacent to the one feed hook on the rotating shaft side.

Component supply device and component mounting device

A method of mounting a component includes an approaching step of causing the pair of clamping members to approach each other with the first body of the first component disposed between the paired clamping members, a clamping step of clamping the first component, and a mounting step of moving the pair of clamping members clamping the first component to the substrate and pressing out the first component clamped by the pair of clamping members with the pusher for mounting on the substrate, when the clamping members mount the first component on the substrate.

Method of mounting component

A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

Method of manufacturing component-mounted substrate

A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.

Component mounting device and method of mounting component

A component mounting apparatus for mounting a component on a substrate includes a pair of chuck claws that sandwich and grip the component; and adapters that are detachably mounted on the chuck claws and grip the component in place of the chuck claws. The adapters are mounted on the chuck claws in accordance with the component that is an object to be mounted and the component is gripped by using the adapters.

Component mounting apparatus

A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.

Electronic component mounting method and electronic component mounting apparatus

A component supply device includes a posture maintainer and a pair of cutting members. The posture maintainer includes a pair of grip members, each of which includes a tip end portion that extends in a traveling direction of a component holding tape. The posture maintainer maintains the posture of a component by gripping a body portion of the component having been supplied to a component supply position with the body portion interposed between the tip end portions of the pair of the grip members. The pair of cutting members cuts a lead portion of the component having been gripped by the pair of grip members with the lead portion interposed between the pair of cutting members in a direction intersecting a traveling direction of the component holding tape.

Component supply device, component mounter, and component-mounted board manufacturing method

There is provided an electronic component mounter configured to include a supplier holder in which a radial lead type electronic component supplier can be mounted, and to cause a mounting head to hold a radial lead type electronic component so as to mount the component on a board positioned by a board holder. The electronic component mounter includes a tape guide passage that guides a tape body after the radial lead type electronic components are picked up from the tape body. The electronic component supplier is configured to further include a posture converter that converts a posture of the tape body from a posture perpendicular to a horizontal plane to a posture parallel to the horizontal plane, after the radial lead type electronic components are picked up from the tape body, and that introduces the tape body to the tape guide passage.

Growing community of inventors

Yamanashi, Japan

Yosuke Nagasawa