Kobe Steel, Ltd.

Kabushiki Kaisha Kobe Seiko Sho

Kabushiki Kaisha Kobe Seiko Sho (kobe Steel, Ltd.)

Yosuke Miwa

Ryoichi Ozaki

Yasuhiro Aruga

Masayasu Nishimura

Motohisa Miyafuji

Yasushi Masago

Shinya Katsura

Isao Hosokawa

Hideki Matsushita

Junichi Ohsako

Syuhei Mori

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width &#x3b2; of the intensity of diffraction of {311} plane in the surface of a Cu&#x2014;Fe&#x2014;P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 &#x3bc;m or less.

Copper alloy sheet for electric and electronic part

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width p of the intensity of diffraction of {311} plane in the surface of a Cu&#x2014;Fe&#x2014;P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I (200) /I (220)) of intensity of diffraction of (1 (200)) from the (200) plane in the sheet surface to intensity of diffraction of (I (220)) from the (220) plane, is 0.3 or less. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 &#x3bc;m or less.

Copper alloy sheets for electrical/electronic part

Provided is a lead frame made of a Cu&#x2014;Fe-based copper alloy strip to improve the heat dissipation in an LED package. An Ag plating reflective film formed on the lead frame enhances the brightness of the LED package. In the Cu&#x2014;Fe-based copper alloy strip, arithmetic mean roughness Ra is 0.2 &#x3bc;m or less, ten-point mean roughness Rzis 1.2 &#x3bc;m or less, and maximum height roughness Rz is 1.5 &#x3bc;m or less and depressions having an average length in a rolling parallel direction of 2 to 100 &#x3bc;m, an average length in the rolling vertical direction of 1-30 &#x3bc;m, and a maximum depth along the rolling parallel direction of 400 nm or less. The Cu&#x2014;Fe-based copper alloy strip contains 1.8-2.6 mass % of Fe, 0.005-0.20 mass % of P, and 0.01-0.50 mass % of Zn or contains 0.01-0.5 mass % of Fe, 0.01-0.20 mass % of P, 0.01-1.0 mass % of Zn, and 0.01-0.15 mass % of Sn.

Copper alloy strip for lead frame of LED

A Cu&#x2014;Fe&#x2014;P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 &#x3bc;m or less and a maximum height Rmax is 1.5 &#x3bc;m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Copper alloy sheet for electric and electronic parts

A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

Copper alloy sheet and QFN package

Copper alloy for use in electric and electronic parts

Conductivity distribution on the cross section of metal or alloy is measured by an eddy current type conductivity meter and conductivity distribution contour map is prepared. Based on the pattern of this conductivity distribution contour map, heat history of an ingot and segregation of added element are analyzed and melting and/or casting conditions of metal or alloy are re-established. This method allows to carry out the testing and analysis within short time and quickly provides assessment results for re-establishment of melting and/or casting conditions. Thereby, metal or alloy ingots which may create poor quality products during the following steps can be eliminated; in particular, applying this method to a manufacturing of copper precipitation hardening alloy and the like, more sound ingots can be obtained and suitability of ingots for the material which should be worked in the following step can be assessed.

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Shimonoseki, Japan

Yosuke Miwa