Nitto-denko Corporation

Yosuke Miki

Yasuhito Ohwaki

Toshihiko Sugimoto

Chiharu Miyaake

A flexible wired circuit board for temperature measurement that can provide an accurate temperature measurement even when placed in a high-temperature atmosphere and can also be provided at a reduced cost. In the flexible wired circuit board for temperature measurement, a conductor layer formed from a metal foil, such as a stainless foil, having a proportional relation between temperature and specific electric resistance is formed on a base insulating layer. Also, a single thin sensor wiring in a sensor portion exposed from a cover insulating layer is formed into a certain pattern by folding back the sensor wiring in a continuous S-shaped form, such that adjacent parts of the wiring extending in parallel are spaced apart from each other at a predetermined interval in a widthwise direction of the conductor layer. The flexible wired circuit board for temperature measurement thus constructed can prevent occurrence of errors in measured temperature even when used in high-temperature atmosphere, thus achieving accurate measurement of temperature, different from the flexible wired circuit board having the conductor layer comprising a copper foil.

Flexible wired circuit board for temperature measurement

A flexible printed circuit comprising a plastic film and a conducting layer, wherein the plastic film exhibits a heat shrinkage rate ellipse having an eccentricity of not more than 0.7 and preferably exhibits an ultrasonic wave propagation rate ellipse having an eccentricity of not more than 0.4 and a polarized microwave transmission intensity ellipse having an eccentricity of not more than 0.55. The flexible printed circuit has improved dimensional accuracy owing to the dimensional stability of the plastic film.

Growing community of inventors

Osaka, Japan

Yosuke Miki