Kokusai Electric Corporation

Yosuke Kuwata

Shinobu Sugiura

Atsushi Umekawa

Akihiro Sato

Masaya Nishida

Tomoyasu Miyashita

Kazuhiro Kimura

Nobuhito Shima

Kenichi Maeda

Ryosuke Arai

Akihiko Hiratsuka

Kaoru Kataoka

There is provided a technique that includes executing a process recipe for processing a substrate; and executing a correction recipe for checking a characteristic value of a supply valve installed at a process gas supply line, wherein the act of executing the correction recipe comprises: supplying an inert gas into the process gas supply line for a certain period of time in a state where an adjusting valve that is installed at an exhaust portion of a process furnace and adjusts an internal pressure of the process furnace is fully opened; detecting a pressure value in a supply pipe provided with the supply valve while supplying the inert gas into the process gas supply line in the state where the adjusting valve is fully opened; and calculating the characteristic value of the supply valve based on the detected pressure value.

Method of manufacturing semiconductor device, method of managing parts, and recording medium

A heating part of covering and heating a gas pipe includes: a thermal insulation portion disposed outside a heat generation body; an enclosure configured to enclose the thermal insulation portion and the heat generation body; a fastening part installed outside the enclose and configured to fasten one end portion and the other end portion of the enclosure in a state in which the one end portion and the other end portion of the enclosure adjoin each other; and a temperature sensing part disposed at the side of the gas pipe with respect to the enclosure at a position facing a surface of the gas pipe and formed in a plate shape with a major surface thereof oriented toward the gas pipe.

Heating part, substrate processing apparatus, and method of manufacturing semiconductor device

Growing community of inventors

Toyama, Japan

Yosuke Kuwata