Renesas Electronics Corporation

Yosuke Katsura

Toshihiko Akiba

Nobuhiro Kinoshita

Kenji Sakata

Yutaka Uematsu

Norio Chujo

Shuuichi Kariyazaki

Kazuyuki Nakagawa

Masayoshi Yagyu

Keita Tsuchiya

Yusuke Tanuma

Shinji Katayama

Reliability of a semiconductor device is improved. The semiconductor device PKGincludes a wiring substrate SUBa semiconductor chip CHPand a capacitor CDC mounted on the upper surfaceof the wiring substrate SUBand a lid LD formed of a metallic plate covering the semiconductor chip CHPand the wiring substrate SUBThe semiconductor chip CHPis bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHPis disposed in the cut off portionprovided in the lid LD, and is exposed from the lid LD.

Semiconductor device including a circuit for transmitting a signal

Reliability of a semiconductor device is improved. The semiconductor device PKGincludes a wiring substrate SUB, a semiconductor chip CHPand a capacitor CDC mounted on the upper surfaceof the wiring substrate SUB, and a lid LD formed of a metallic plate covering the semiconductor chip CHPand the wiring substrate SUB. The semiconductor chip CHPis bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP, is disposed in the cut off portionprovided in the lid LD, and is exposed from the lid LD.

Performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip and a chip component that are electrically connected to each other via a wiring substrate. The semiconductor chip includes an input/output circuit and an electrode pad electrically connected to the input/output circuit and transmitting the signal. The chip component includes a plurality of types of passive elements and includes an equalizer circuit for correcting signal waveforms of the signal, and electrodes electrically connected to the equalizer circuit. The path length from the signal electrode of the semiconductor chip to the electrode of the chip component is 1/16 or more and 3.5/16 or less with respect to the wavelength of the signal.

Semiconductor device

A semiconductor device includes a memory component, which is a semiconductor component (a semiconductor chip or a semiconductor package), to be mounted over an upper surface of a wiring substrate. In addition, in the upper surface, a distance between the memory component and a first substrate side of the upper surface is smaller than a distance between the memory component and a second substrate side of the upper surface. In addition, in the upper surface, a dam portion is formed between the memory component and the first substrate side.

Growing community of inventors

Tokyo, Japan

Yosuke Katsura