Nissan Chemical Industries Limited

Yosuke Iinuma

Shinichi Maeda

Shinya Arase

Shinsuke Tsuji

To provide a coating fluid for a gate insulating film, which can be baked at a low temperature of at most 180C; a gate insulating film having excellent solvent resistance and further having good characteristics in e.g. specific resistance or semiconductor mobility; and an organic transistor employing the gate insulating film. A coating fluid for a gate insulating film, which comprises a polyimide obtainable by cyclodehydration of a polyamic acid having repeating units of a specific structure, a gate insulating film employing the coating fluid, and the organic transistor employing the gate insulating film.

Coating liquid for gate insulating film, gate insulating film and organic transistor

There is provided a polyimide precursor which can alter the hydrophilicity/hydrophobicity of the surface of a cured film formed readily even by a low level of ultraviolet ray irradiation; and a polyimide produced from the polyimide precursor. The polyimide precursor having a structure represented by the following formula (1): where A represents a tetravalent organic group; B represents a bivalent organic group having a thiol ester bond in its main chain; Rand Rindependently represent a hydrogen atom or a univalent organic group; and n represents a natural number.

Polyimide precursor, polyimide, and coating solution for under layer film for image formation

There is provided a polyimide precursor which can alter the hydrophilicity/hydrophobicity of the surface of a cured film formed readily even by a low level of ultraviolet ray irradiation; and a polyimide produced from the polyimide precursor. The polyimide precursor having a structure represented by the following formula (1): 

The present invention provides a positive photosensitive resin composition which can form a cured film excellent in process resistance such as heat resistance, solvent resistance or long-time baking resistance and transparency, and which is excellent in photosensitive properties such as resolution and sensitivity, and which has high storage stability and a wide process margin. Further, the present invention provides a positive photosensitive resin composition having such high reliability that no deterioration of electrical characteristics will be led in its application for liquid crystal display devices. A positive photosensitive resin composition characterized by comprising an alkali-soluble resin which is a copolymer essentially comprising an unsaturated carboxylic acid derivative and an N-substituted maleimide and which has a number average molecular weight of from 2,000 to 20,000, a 1,2-quinone diazide compound represented by the formula (1): (wherein each of D independently is a hydrogen atom or an organic group having a 1,2-quinone diazide group, Ris a tetravalent organic group, provided that at least one of D is an organic group having a 1,2-quinone diazide group), and from 5 to 50 parts by weight, per the alkali-soluble resin, of a crosslinking compound represented by the formula (2): (wherein n is an integer of from 2 to 10, m is an integer of from 0 to 4, and Ris a n-valent organic group).

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Funabashi, Japan

Yosuke Iinuma