Murata Manufacturing Co., Ltd.

Yosuke Hirata

Takashi Hiramatsu

Yoshito Saito

Hideaki Tsuji

Hiroyuki Wada

Nagato Omori

Hiroyuki Ukai

Masayuki Ishihara

A method for manufacturing a laminated ceramic capacitor having a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 &#x3bc;m or less in thickness, and are located in an area defined by a width-direction gap of 30 &#x3bc;m or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 &#x3bc;m or less interposed with respect to each of the pair of principal surfaces.

Laminated ceramic electronic component

A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion.

Multilayer ceramic electronic component

A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40&#xb0; C./second or more.

Laminated ceramic electronic component and manufacturing method therefor

A laminated ceramic capacitor including a laminated body having a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The internal electrodes have a plurality of ceramic columnar members formed therein, which project into the internal electrodes from interfaces between the ceramic layers and the internal electrodes, but do not penetrate in the thickness direction of the internal electrodes.

A method of manufacturing a laminated body in a raw state for a laminated ceramic capacitor, which includes dielectric ceramic layers containing a dielectric ceramic raw material powder for and internal electrodes, in which a heat treatment is carried out in accordance with a temperature profile in which the average rate of temperature rise is 40&#xb0; C./second or more from room temperature to a maximum temperature. The dielectric ceramic raw material powder contains a BaTiOsystem as its main constituent and contains Re (Re is at least one selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu) as an accessory constituent, in which the content of Re is 0.3 to 3 parts by mol with respect to 100 parts by mol of the main constituent.

Manufacturing method for laminated ceramic capacitor, and laminated ceramic capacitor

Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body which has internal electrodes, even when ceramic layers and the internal electrodes are reduced in thickness. The laminated body is divided into a large grain region in which the ceramic has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter. The large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which the internal electrodes are present in the laminated body. In order to obtain the laminated body, a heat treatment is carried out in the firing step with a temperature profile in which the average rate of temperature increase from room temperature to the maximum temperature is 40&#xb0; C./second or more.

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Nagaokakyo, Japan

Yosuke Hirata