Matsushita Electric Works, Ltd.

Yosiyuki Uchinono

Yoshimitsu Nakamura

Norio Yoshida

Masao Kubo

Toshiyuki Suzuki

Kazuo Kamada

Takeshi Okamoto

Ryuji Ohtani

Kunzi Nakashima

A method for manufacturing a printed circuit board is to form on a top surface of an insulating substrate a layer of such plating ground as a metal film, to irradiate such electromagetic wave as a laser to a boundary edge zone of non-circuit parts with respect to circuit-printing parts on the insulating substrate in correspondence to a pattern of the non-circuit parts to remove the plating ground layer at the part irradiate by the electromagnetic wave with the plating ground layer at the non-irradiated part left as formed, and thereafter to form a plating on the surface of the plating ground layer at the non-irradiated parts, whereby it is enabled to allow the laser irradiation to be carried out only with respect to the boundary edge zone of the non-circuit parts, without irradiating all over the non-circuit parts.

Method for manufacturing printed circuit board

An energy-beam welding method for two metal pieces is performed by bringing a cylindrical jig into axial engagement with one of the metal pieces at welding zone between them which are placed as joined, and irradiating an energy beam to the welding zone through the cylindrical jig in its axial direction, causing at least part of the energy beam reflected on inner peripheral wall of the cylindrical jig to be directed to the welding zone, whereby the metal pieces are mutually welded easily reliably.

Energy-beam welding method

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Kadome, Japan

Yosiyuki Uchinono