Fujitsu Corporation

Yosimasa Miyajima

Koji Hashizume

Takanori Muramoto

Tsukasa Adachi

Takuya Ohno

Takao Kojima

A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Apparatus and method for fabricating bonded substrate

Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Growing community of inventors

Kasugai, Japan

Yosimasa Miyajima