Matsushita Electric Industrial Co., Ltd.

Yosihiro Tomita

Akihiko Namba

Osamu Kawasaki

Hiroki Sato

Keiji Onishi

Yutaka Taguchi

Atsushi Komatsu

Masayuki Okano

Kazuo Eda

Shun-ichi Seki

Tetsuyosi Ogura

A variable dot ink-jet printer having an ejection flow passage with a decrease in sectional area from an ejection port toward the interior of the flow passage and up to a boundary. A draw-in part draws an ink front position in the interior of the flow passage. A push-out part pushes out the ink front position outside the flow passage. When ejecting a small ink drop, the ink front position is drawn at a place having an increase in sectional area by the draw-in part. The ink is pushed outward by the push-out part at such a speed as to exit from an edge of an area of the boundary on the ejection port side.

Variable dot ink-jet printer

A liquid injection device has a liquid pressurizing chamber having one or a plurality of apertures, a liquid injection port provided at a part of the liquid pressurizing chamber, a liquid pressurizing member arranged adjacent to the liquid pressurizing chamber, a liquid passage arranged adjacent to the liquid pressurizing chamber; wherein within the aperture(s), a peripheral edge portion of the aperture(s) located at a position opposite to the liquid pressurizing member and the liquid pressurizing member are arranged to be apart from each other at a gap with a predetermined size; further wherein liquid is injected through the liquid injection port by driving the liquid pressurizing member to thereby pressurize the liquid supplied from the liquid passage into the liquid pressurizing chamber.

Liquid injection device, manufacturing method therefor, liquid injection method and manufacturing method for piezo-electric actuator

Disclosed is a SAW element with a propagation substrate that is a piezoelectric substrate. An auxiliary substrate is laminated on one surface of the propagation substrate by way of direct bonding, and a comb-shaped electrode is formed on another surface of the propagation substrate that is opposite the surface with the auxiliary substrate. The electrode excites an acoustic wave. The propagation substrate and the auxiliary substrate are not bonded to each other in at least a region immediately below a region where the comb-shaped electrode is formed. A coefficient of thermal expansion in a propagation direction of the acoustic wave of the auxiliary substrate is smaller than a coefficient of thermal expansion in a propagation direction of the acoustic wave of the propagation substrate.

Surface acoustic wave element

A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.

Surface acoustic wave devices and their manufacturing method

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Osaka, Japan

Yosihiro Tomita